ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, through its operating subsidiary ACM Research (Shanghai), announced the introduction of its Ultra PmaxTM Plasma-Enhanced Chemical Vapor Deposition (PECVD) tool, marking ACM’s entry into another major new product category. ACM expects to ship its first PECVD evaluation tool to a China-based customer in the next few weeks.
“Our Ultra PmaxTM PECVD tool marks expansion into another new process area of front-end semiconductor manufacturing,” said Jian Wang, CEO of ACM Research (Shanghai), “Many of our customers are 28nm and above logic device providers. We anticipate a need to increase capacity at more mature nodes, as mature node production in China is significantly lower than consumption. The new PECVD tool provides ACM with another opportunity to better serve our customers while addressing the global logic and memory market. We estimate that our total addressable global market will double with the Ultra PmaxTM category announced and the Ultra Track category announced last month.”