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A special thanks to our 2017 sponsors

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Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI), its Level 1 ADRs participate in the Nasdaq International Program (OTC: BESIY) and its headquarters are located in Duiven, the Netherlands


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SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets. With the addition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing of package marking, underfill dams and solder resist. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.


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Plasma-Therm® is a leading provider of advanced plasma processing equipment. Plasma-Therm systems perform critical process steps in the fabrication of integrated circuits, micro-mechanical devices, solar power cells, lighting, and components of products from computers and home electronics to military systems and satellites. Specifically, Plasma-Therm systems employ innovative technology to etch and deposit thin films. The company’s Mask Etcher® series for photomask production has exceeded technology roadmap milestones for more than 15 years. Plasma-Therm’s Singulator® systems bring the precision and speed of plasma dicing to chip-packaging applications. Manufacturers, academic and governmental institutions depend on Plasma-Therm equipment, designed with “lab-to-fab” flexibility to meet the requirements of both R&D and volume production. Plasma-Therm’s products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Plasma-Therm’s status as a preferred supplier of plasma process equipment has been recognized with VLSIresearch Customer Satisfaction awards for 17 consecutive years, including “RANKED 1st” awards from 2012 to 2016.


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UnitySC is recognized worldwide as a key player in inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with microscopy, temporal-mode interferometry, and spectrometry, which enables customers to deliver higher yields and faster time to market. We provide standard and customized solutions adapted to specific industrial needs and constraints, enabling a new era in process control. Headquartered in Grenoble (France), the company maintains offices in Taiwan and is supported by a network of representatives and distributors.

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Our parent: Illinois Tool Works (“ITW”) (, NYSE: ITW) is a Fortune 200 global diversified industrial manufacturer of value added consumables and specialty equipment with related service businesses. Our Technology Group (located in CA, USA) of Simco-Ion business unit (ISO-9001 certified, headquartered in PA, USA, are the world’s leading provider of electrostatic control and process environment monitoring solutions in various advanced technology industries, as semiconductor, flat panel display, life science…etc. In brief, our solutions typically provide two primary function:

  • The first use is to monitor, reduce or eliminate the possibility of electrostatic discharge (ESD) events, which Semiconductor Back-End industry are deeply worried.
  • The second use by neutralizing surfaces so that particles are not attracted to, which Semiconductor Front-End industry is our key market, especially when the technology advances to smaller geometry.

Looking forward to discussing with for your information.

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Shenzhen Samcien Semiconductor Materials Co., Ltd was founded in 2016, focusing on the key materials for wafer level packaging. Our company is based on the thin and short of the integrated circuit (IC), and provide total solution for thin wafer handling, fan-out packaging and through silicon via (TSV). Until now, we supply the mature advanced packaging materials to the industry, such as temporary bonding materials, polymer insulation for TSV and electroless nickel and gold. Our aim is to become the world’s leading supplier of key materials for wafer level packaging.

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