ASMPT AMICRA, a worldwide supplier of ultra-high precision die attach equipment that specializes in ultra-high precision die attach solutions, and Teramount , the leader in scalable fiber connectivity to chips, announced a collaboration to address the challenge of connecting fibers to silicon photonic chips, to meet the ever-growing bandwidth demands in datacom and telecom applications.
In the rapidly evolving fields of artificial intelligence and high-performance networking, one of the primary challenges has been to achieve seamless fiber-to-chip connectivity. The collaboration between the two companies, based on placement of Teramount’s pioneering wafer-level self-aligning optical elements on customer’s Silicon Photonics wafers using ASMPT AMICRA’s advanced precision die attach machineries, promises a revolutionary solution to this long-standing challenge.
“There is a clear demand from customers for high volume Silicon Photonics manufacturing and packaging” said Hesham Taha, Teramount’s President and CEO. “They are keen to see this supported by equipment that’s already used in high volume OSAT environments. ASMPT AMICRA, a front-runner in die-to-wafer attach equipment, is an ideal partner for Teramount to scale up and meet this rising customer demand”.
“Silicon Photonics is the key technology of our future everyday life. The fast transfer of constantly growing amounts of data requires ever increasing accuracy when assembling the semiconductor components”, underlines Dr. Johann Weinhaendler, Managing Director of ASMPT AMICRA. “In Teramount we see an optimal expert in the development of high-speed connectivity solutions where we meet each other to incorporate their products via high-precision passive wafer-level assembly of optical lens components.”