Avalanche Technology and LA Semiconductor announce onshoring of chiplet solutions in a US trusted fab

Avalanche Technology, the leader in next generation MRAM technology, announced plans to onshore critical chiplet technology with LA Semiconductor, an onshore US mixed-signal foundry. Leveraging the newly acquired Trusted fab in Pocatello, ID (formerly owned by onsemi and before 2008, AMI) and its 180nm mixed signal and power process capabilities, LA Semiconductor is expanding the onshore semiconductor manufacturing footprint. Avalanche Technology’s third generation Persistent SRAM (based on advanced STT-MRAM technology) device family is known for its benchmark setting densities, power, reliability, and endurance, but the rapid interface customization is made possible with critical mixed-signal chiplet technologies.

“With this onshoring of critical technology, Avalanche is further demonstrating commitment to the aerospace and defense community with an assured source of domestic manufacturing in LA Semiconductor,” said Danny Sabour, Vice President of Marketing and Business Development at Avalanche Technology.“ Our Gen 3 Persistent SRAM solutions embrace modularity to support accelerated cycles of learning required for high reliability aerospace and defense products while enabling rapid customization more commonly found in commercial industries.”

“We are pleased to work with a market leader like Avalanche Technology to enable device and system level enhancements for advanced high reliability memory solutions,” said Mike Ward, CEO of LA Semiconductor. “With our targeted mixed-signal design services partners, combined with dedicated onshore foundry capabilities, LA Semiconductor is well positioned to serve the growing demand for tailored domestic manufacturing solutions.”

Avalanche Gen 3 Persistent SRAM

The Gen 3 Space Grade families are offered as a standard product in Parallel with asynchronous SRAM-compatible timing and Dual QuadSPI high speed serial interface in various density options from 1Gb to 8Gb. Data is always non-volatile and Space grade devices have industry write cycle endurance at 10^16. The devices are offered in small footprint packaging and extended operating temperature range (-40°C to 125°C) with a JEDEC qualification flow, where every device goes through a 48-hour burn in before being shipped to customers. There are additional qualification screening options available through partners.