Eliyan , credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, announced it has joined two key industry standardization efforts, bringing its expertise to enable more universal and cost-effective methods for implementing die-to-die interconnect in heterogenous single packaged systems. Eliyan will have representatives on both the influential Universal Chiplet Interconnect Express (UCIe) and JEDEC Solid State Technology Association standards , adding deep technical insights, production proven technology, and experience in evolving semiconductor industry standards to both organizations.
To support its commercial growth and stepped-up involvement in industry initiatives, Eliyan also announced the addition of two veteran semiconductor industry executives, Kevin Donnelly and Farhad Tabrizi, to its growing leadership team.
Eliyan will be represented at the inaugural Chiplet Summit on January 24-26, 2023 in San Jose, Calif. This includes executives participating on four panel discussions exploring the current state and future of die-to-die interconnect technologies.
Eliyan’s founding CEO Ramin Farjadrad is the inventor of the innovative and proven Bunch of Wires (BoW) standard, which has already been adopted by the Open Compute Project (OCP). In addition, Eliyan’s current offering, the NuLink™ PHY, is compatible with UCIe as well as High Bandwidth Memory (HBM) protocols. The NuLink PHY product can be implemented in organic substrate packaging, and has proven to achieve similar bandwidth, power efficiency, and latency as die-to-die implementations using advanced packaging technologies, but without the drawbacks of specialized approaches. Farjadrad’s experience also includes pioneering work in creating connectivity technologies such as PAM4 SerDes, Multi-Gbps Enterprise Ethernet, and Multi-Gbps Automotive Ethernet that were eventually adopted as IEEE Standards.
“Eilyan has deep roots in driving standards-based approaches to solving difficult technical challenges, including our work with OCP, prior to the formation of UCIe, to use our BoW interconnect approach as a basis for that organization’s multi-die interconnect standard”, said Patrick Soheili, an Eliyan co-founder and director. “Both UCIe and JEDEC are important enablers for addressing the challenges and leverage the potential of multi-die systems and we believe our expertise and technology, proven in production and developed with openness in mind, can be important assets to drive universal methods to push the chiplet era forward. To further deepen our experience in working within complex industry ecosystems, we are delighted to welcome Kevin and Farhad to the company. They will both be instrumental in creating mutually beneficial solutions for all stakeholders.”
Eliyan’s role in UCIe will include membership on relevant committees and involvement in the continued definition of the standard for connecting multi-chip components that can use different process nodes and components from different supplies in the same package. Similarly, at JEDEC Eliyan will work with the relevant committees and technical to address challenges in memory-enabled applications that require efficient and cost-effective interconnect approaches to leverage sophisticated architectures.