Search

Dow launches OPTIPLANE™ CMP slurry platform for Advanced Semiconductor Manufacturing

Optimized for performance, next-generation CMP slurries represent Dow’s most advanced slurries for dielectric applications.

Dow Electronic Materials, a business unit of The Dow Chemical Company, launched its OPTIPLANE™ slurry platform for chemical mechanical planarization (CMP).

The OPTIPLANE slurry family was developed to satisfy customer demand for advanced slurries that can meet defect reduction requirements and tighter specifications at a competitive cost for manufacturing the next generation of advanced semiconductor devices.

The global CMP consumables market continues to grow, driven in part by new 3D logic, NAND flash, and packaging applications demanding greatly improved planarization and minimal defectivity to meet the performance requirements of numerous advanced electronic devices.

Logic and memory chip companies producing advanced semiconductor device wafers increasingly face challenges meeting evolving demands for enhanced performance and reduced cost, while maximizing yield. CMP becomes a key enabler in the manufacturing process, and the use of CMP is increasing,” said Adam Manzonie, global slurry business director, CMP Technologies, Dow Electronic Materials. “The OPTIPLANE™ slurry platform has been developed to respond to our customers’ needs for versatile and cost-effective CMP slurries that address emerging requirements.”

OPTIPLANE CMP slurries deliver a range of tunable removal rates through advanced chemistries and optimized particle concentration. Selectivities are adjustable to meet unique customer specifications. While enabling excellent planarization efficiency and low defect levels, the dilutable OPTIPLANE CMP slurry platform also offers improvements in yield and cost of ownership (CoO).

As a technology leader in CMP, Dow has a strong understanding of the material interactions between CMP polishing pads and slurries,” said Marty DeGroot, global R&D director, CMP Technologies, Dow Electronic Materials. “This allows us to leverage our R&D capabilities to develop slurry formulations that correspond with pad performance and deliver unique customer-specific performance benefits.

The first formulation to be introduced is the OPTIPLANE™ 2118 CMP slurry, a next-generation interlayer dielectric (ILD) slurry, which can also be used in various front-end-of-line (FEOL) applications.

Source: http://www.dow.com

up