In booth 1190 at the International Microwave Symposium (IMS 2019) in Boston, MA, USA, Luxembourg-registered synthetic diamond materials firm Element Six (E6, part of the De Beers) is launching the diamond thermal-material-grade Diafilm TM220, which is claimed to be the first diamond thermal material engineered to offer industrial users thermal conductivity in excess of 2200W/mK.
The launch is in response to the ever-increasing demand for more content and bandwidth, which is pushing the boundaries of semiconductor thermal management. The shift to higher frequencies is creating a unique opportunity for chemical vapor deposition (CVD) diamond, and Element Six says that the launch extends its portfolio of thermal materials to even higher heat-spreading capabilities.
The new grade of CVD diamond thermal material is suitable for the thermal management of high-power-density radio frequency (RF) and application-specific integrated circuits (ASIC) devices, as well resistive components for power management at high frequencies. Diafilm TM220 also has applications in gallium nitride (GaN)-based RF, in addition to monolithic microwave integrated circuits (MMICs) for phase-array radar, space and satellite, 5G base stations and beyond. Moreover, the success of terabit rate optoelectronics networks for both metro and long-haul content delivery is predicated on high-efficiency thermal management.
As with the other material grades of Diafilm TM, TM220 is thermally isotropic, spreading heat with equal efficiency in a planar direction as well as through the material. Additional Diafilm TM220 properties include dielectric permittivity, optical clarity, electrical insulation, low density and chemical inertness, making it suitable for pushing the boundaries of advanced thermal management as either an active or passive component, says the firm.
“This new material validates the unique multi-functionality of CVD diamond and further demonstrates Element Six’s leadership and innovation in CVD diamond synthesis and material characterization, where we continue to open up new areas of advancement,” says Speaking at IMS, Thomas Obeloer, business development manager for Thermal Applications. “We have already had positive feedback from customers in RF device packaging, x-ray generation and the high-performance ASIC sector, who were early adopters of the TM220 grade,” he adds.
Material blanks of Diafilm TM220 are available in standard thicknesses and can be made to meet specific customer requirements. To match the high performance of the diamond, the use of high-quality, sputter-deposited thin-film metallization is offered, and specifications to meet advanced needs for wire bonding or direct deposition of solder materials onto the CVD diamond can be supplied.