Micron is sampling UFS 2.1 NAND flash modules for automotive applications with volume scheduled for Q3.
They use 64-layer, TLC ICs and come in densities from 32GB to 256GB.
The memories deliver up to 940 MB/s reads and 650 MB/s writes. UFS delivers up to 3X faster reads and more than 2X faster writes than e.MMC interfaces.
Operating temperature is -40 to 105 C and -40 to 95. They are qualified to AEC-Q100 and IATF 16949-compliant.