MRSI launches new die bonders with improved accuracy

MRSI Systems, a manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems is proud to announce the introduction of the MRSI-HVM1 and MRSI-H1 die bonders with 1µm machine accuracy.

The new products, MRSI-H1 and MRSI-HVM1, have been developed from our popular MRSI-H/MRSI-HVM platforms, further improving accuracy to 1 micron level and providing ideal solutions for the increasingly demanding applications such as mass manufacturing of silicon photonics and LIDAR. The MRSI-H1 and MRSI-HVM1 will be available in the Q4, 2022. MRSI’s die bonding solutions help our customers to enable just-in-time supply and fast-pace innovations of critical components for high-growth market segments. 

These products inherit the MRSI tradition of combining accuracy, speed and flexibility to reduce NPI cost, improve production agility and hence increase return-of-investment for customers. They also come with MRSI’s long proven product reliability and global customer support.

“We are proud to announce the 1µm new die bonders MRSI-H1 and MRSI-HVM1 as part of our efforts to continuously innovate and improve our products to help our customers meet the markets’ demands,” said Dr. Irving Wang, Director of Product Marketing, MRSI Systems.