Okmetic, a leading supplier of advanced silicon wafers for MEMS, sensor, RF, and Power devices, has entered volume production at its expanded Vantaa fab in Finland. The site focuses on 150-200 mm silicon and bonded silicon-on-insulator (SOI) wafers, with the expansion significantly increasing 200 mm polished wafer capacity.
“With this expansion, Okmetic strengthens its position as an EU-based, one-stop supplier for 150 to 200 mm silicon wafer platforms serving the MEMS, sensor, RF, and Power markets. The increase in 200 mm polished wafer capacity strengthens long-term supply stability for critical semiconductor applications,” says President and CEO Kai Seikku.
First wafers from the fab expansion were produced in June 2025, marking the start of a structured qualification and ramp phase. With volume production now underway in early 2026, Okmetic is delivering wafers from the expanded capacity to customers, strengthening long-term supply readiness across MEMS, RF, Power, and GaN-based applications.
Vantaa site Fab expansion is set to more than double Okmetic capacity by 2030. The construction of the expansion began in early 2023. Spanning over 40,000 m², the expansion includes a 6,000 m² cleanroom area along with crystal growth and wafering areas. The fab expansion is equipped with state-of-the-art technology, with focus on energy efficiency.
Building on previous investments, Okmetic has significantly expanded its manufacturing capabilities in recent years, including doubling bonded SOI production capacity between 2017 and 2021 and adding a patterning line for Cavity SOI (C-SOI®) production in 2019.
This latest expansion further strengthens Okmetic’s ability to meet evolving semiconductor industry demands. By significantly increasing 200 mm polished wafer capacity, it reinforces Okmetic’s position as a leading supplier of advanced silicon wafers based in Europe, ensuring a stable and high-quality supply of 150-200 mm wafers.
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