SYNAPS 2021 – On-Demand Conference

You have reached the On-Demand Conference section of SYNAPS 2021.
You can click on the day of the presentation to access the replay video. You can also find the proceedings by clicking on the title of the presentation.

More information available here.

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9:05 am – 9:40 am : Samsung Electronics Corporation
Heterogeneous Integration: Wafer Level 2.5D and 3D Packaging – Seung Wook Yoon

9:40 am – 10:05 am : SPTS
High Quality, Low Temperature (<200°C) PECVD Dielectrics for Advanced Packaging Applications – Keith Buchanan

10:05 am – 10:30 am : Applied Materials Inc.
Process and Equipment Solutions For Package Interconnect Scaling – Ramesh Chidambaram

10:40 am – 11:05 am : Besi
Advances in Die Attach Technologies for Heterogeneous Integration – Chris Scanlan

11:05 am – 11:30 am : Kulicke & Soffa
K&S New Fluxless 3D Chip to Wafer Package – Chan Pin Chong

11:30 am – 11:55 am : Tianshui Huatian Microelectronics
Huatian Advanced Package Tech. Introduction – Min Wang

Passcode: 4j4jR@EE

9:05 am – 9:40 am : UTAC
The Real Third Wave of Semiconductor Market – Asif Chowdhury

9:40 am – 10:05 am : Fraunhofer
The Rise of Fan-out Wafer and Panel Level Packaging – Infrastructural Implications – Tanja Braun

10:05 am – 10:30 am : Tongfu Microelectronics
Opportunities and challenges of FO SiP – Xie Hong

10:40 am – 11:05 am : ERS electronic GmbH
Warpage Response of Thermal Debonding with Tri-Temperature Treatment on Different FOWLP Layout – Debbie-Claire Sanchez

11:05 am – 11:30 am : ASM-PT
From strip substrate to wafer as a substrate – Challenges and market trends for high density, complex wafer level System-in-Packages (WLSiP) – Johannes Lettenbauer

11:30 am – 11:55 am : Yole Développement
Latest trends in Fan-out packaging technology – Santosh Kumar

9:05 pm – 9:40 am : NXP
Advanced Packaging for Autonomous Driving – Poh Leng Eu

9:40 am – 10:05 am : Heraeus Electronics
Package Design Cycle Time Reduction with Close Collaborations – Li-san Chan

10:05 am – 10:30 am : ON Semiconductor
New Transfer Molded Power Integrated Module (TMPIM) for Industrial Drive – Jinchang Zhou

10:40 am – 11:05 am : AT&S
Functional integration in advanced substrates beyond embedded die – Christian Vockenberger

11:05 am – 11:30 am : NCAP
Review and Discussion of 2.5D and 3D Optoelectronics Integration – Dr. Xue Haiyun

11:30 am – 11:55 am : System Plus Consulting
Advanced Packaging Technology Trends – Belinda Dube