TDK starts full-scale production of SmartSonic ICU-20201 ultrasonic Time-of-Flight sensor

TDK (TSE: 6762) announces the start of full-scale production of its InvenSense SmartSonic™ ICU-20201 ultrasonic Time-of-Flight (ToF) sensor. InvenSense’s SmartSonic™ family of ultrasonic Time-of-Flight (ToF) sensors integrate a MEMS PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with an ultra-low power SoC (system on chip) in a miniature reflowable package. Based on ultrasonic pulse-echo measurements, the ToF sensor provides millimeter-accurate and robust range measurements to targets at distances up to 5m, in any lighting condition, including full sunlight, and independently of the target’s color and optical transparency.

This new sensor gives devices the sensitivity required for accurate obstacle avoidance or proximity/presence sensing, used frequently in robotics and drones, or mobile and computing devices for example. It is also highly relevant in settings that require shelf inventory monitoring or level sensing, such as in smart homes or smart buildings.

The ICU-20201 is the latest release in this sensor family that embeds a more powerful on-chip processor with higher computational power. The enhanced processing capabilities allow fitting and running a wide range of application algorithms on-chip, offloading the system MCU completely.

“Thanks to its enhanced capability, ICU-20201 allows the design of smarter and lower power solutions, making the final product greener, safer, and more aware of the surrounding environment,” said Massimo Mascotto, Director of Product Marketing, InvenSense, a TDK. “Its increased computational capability enables smarter product design and an enhanced end user experience for our customers and partners.”

The ICU-20201, in an ultra-compact package footprint of 3.5 x 3.5 mm², is available from multiple distributors worldwide. For additional information or to request a sample, please visit or contact InvenSense Sales at


  • ToF: Time of Flight
  • FoV: Field of View
  • EV: Evaluation module
  • DK: Developer kit
  • MEMS: Micro-electro-mechanical systems

Main applications

  • Presence detection and motion detection for smart door lock
  • Proximity/presence sensing for mobile and computing devices
  • Obstacle avoidance for robotics and drones

Main features and benefits

  • Second generation
  • Ultra-low power
  • Compact size; miniature ultrasonic sensor
  • Wide operating range from 20 cm to 5 m
  • Works in any lighting condition
  • Detects objects of any color and optical transparency
  • Customizable field of view (FoV) up to 180°
  • 3.5 mm x 3.5 mm x 1.26 mm, 8-pin LGA package