Texas Instruments (TI) newest 300-millimeter wafer fab in Richardson, Texas, has started initial production and will ramp over the coming months to support the future growth of semiconductors in electronics. RFAB stands for “R”, for Richardson, “FAB” for fabrication, RFAB2 is connected to RFAB1, which opened in 2009 as the world’s first 300-mm analog wafer fab, and is one of six new 300-mm wafer fabs our company is adding to our manufacturing operations.
The new fab is more than 30% larger than RFAB1, offering more than 630,000 square feet of total clean room space between the two fabs. Fifteen miles of automated, overhead delivery systems will seamlessly move wafers between the two fabs once fully built out.
At full production, the Richardson fabs will manufacture more than 100 million analog chips every day that will go into electronics everywhere – from renewable energy sources to electric vehicles. TI recently announced a $30 billion investment in four new fabs in Sherman, Texas, last year. Construction of the first and second fabs is under way, with production from the first fab expected in 2025.