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The key questions about advanced packaging in China, addressed by Yole Développement and NCAP

On April 21st and 22nd, the National Center for Advanced Packaging (NCAP China) and Yole Développement (Yole) held the 2016 Advanced Packaging and System Integration Technology Symposium. This follows the successful inaugural meeting held in 2014, and underlines the promise of the collaboration between the two organizations that has flourished in the time since.

The event emphasised Yole’s interest in the advanced packaging industry in Greater China, and the market research, technology and strategy consulting company’s desire to reinforce its business position and expand its existing network in this region. Yole recently released its first report dedicated to the Chinese advanced packaging industry, entitled Status and Prospects for the Advanced Packaging Industry in China. We expect the Chinese IC industry to grow significantly in coming years, reaching up to $149B by 2020, which would represent almost 40% of the global market. Yole estimates the advanced packaging market in China will be $2.5B in 2016 and expects it to reach $4.6B in 2020 at an impressive 16% compound annual growth rate (CAGR).

ChinaAPmarketforecast June2016

 (Source: Status and Prospects for the Advanced Packaging Industry in China, Yole Développement, June 2016)

During the April NCAP and Yole symposium, numerous relevant presentations and discussions took place. Key players from the advanced packaging area attended this event and exchanged their visions on the growth of this segment, the challenges seen in the industry with the new emerging technologies and the new solutions developed to address them.

• For the first time, Huatian Technology presented their new fan-out process: embedded Silicon Fan Out (eSiFO). In eSiFO, a silicon wafer is used as the carrier. Known good die are embedded in a cavity processed on the wafer and the microscale gap between the die and cavity walls is filled by epoxy material.

• SPEED Technology presented on development of fingerprint sensors (FPS) using through-silicon via (TSV) technology, currently found in smartphones from some Chinese vendors. We have also already seen FPS packaged using TSV technology in the Apple iPhone 6/6+.

• JCET discussed their development of molded interconnect substrate (MIS) packages. Their 1L MIS package has been in mass production since 2011 and the 2L package passed internal qualification last year. Currently it’s mostly used in power and radio-frequency applications but they are also targeting automotive. Their target is to achieve ultra-thin MIS packages that are just 0.23mm wide.

• Many other companies presented their latest updates including: Alpha Szenszor, ASE Group, ASM Pacific Technology, ASTRI, Besi, Brewer Sciences, BroadPak Corporation, Evatec, EV Group, Huawei, JCAP, JCET Group, NCAP, Nepes, Plasma-Therm, SCHOTT, Sinyang, SMIC, SPTS/Orbotech, STATS ChipPAC, and Zeta Instruments.

NCAPYoleAttendance2016B

The symposium took place in Wuxi, China, over a day and a half. The event attracted more than 100 international participants, from more than 60 companies and universities with strong high level representation, and over 70% of attendees from China. During this symposium, participants discovered an exciting program of seven sessions including 19 industrial presentations. A panel session “Is the supply chain ready to support the latest advancements in packaging?” addressed the key questions that industry is facing today. These included: What are the critical bottlenecks for conversion from wafer to panel for fan out technology? What are the strategies of the substrate suppliers regarding increasing fan-out wafer level packaging (FOWLP) adoption? What is your opinion about the chance of Chinese equipment and materials suppliers challenging the dominance of global players in Advanced Packaging?

The aim of the symposium was to present the status of the advanced packaging industry and its latest innovations through seven dedicated sessions. The sessions were:NCAPYoleAttendance2016A
• Interposer and 3D Integration Technologies
• Advanced Wafer Level Packaging Technologies
• Key Manufacturing Processes for Advanced Packaging
• Module and System Integration
• MEMS and Sensors
• Equipment for Advanced Packaging
• Equipment and Material for Advanced Processes.

All topics were addressed by industrial experts from various organizations across the supply chain. The event was sponsored by Besi, Plasma-Therm, SPTS and ZETA Instruments, who also contributed to the program.

Based on this success, NCAP and Yole are announcing the continuation of this collaboration and establishment of an annual Advanced Packaging and Integration Technology Symposium. NCAP and Yole will keep the Advanced Packaging Community informed about the organization of this event. Stay tuned for 2017 edition !

Source: www.yole.fr 

Yole Status and Prospects for the Advanced Packaging Industry in China June 2016Status and Prospects for the Advanced Packaging Industry in China
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.

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