Trinamix publishes white paper on beam profile analysis for 3D imaging and material detection

Recently, trinamiX introduced a novel technology called Beam Profile Analysis to both measure distance and obtain material features from projected laser spots. At the core of the innovation is a new class of algorithms, which provides features derived from the analysis of the two-dimensional intensity distribution of each projected spot. These features correlate with distance and material properties and can be further processed by machine-learning approaches. A Beam Profile Analysis hardware module can be built from components available at scale and consists of a standard CMOS camera and a dot projector.

The main components are the camera and a laser-based dot projector. The camera captures an image of the scene illuminated by the projector. Further processing of the image is performed on mobile, embedded or PC type platforms.