TSMC roadmap lays out advanced CoWoS packaging technologies, ready for next-gen chiplet architectures & HBM3 memory

By Hassan Mujtaba for wccftech – TSMC has laid out its advanced packaging technology roadmap and showcased its next-gen CoWoS solutions which are ready for next-gen chiplet architectures and memory solutions.

The Taiwanese-based semiconductor giant has gained rapid progress in deploying advanced chip packaging technologies in the industry. Within a decade, the company has launched five different generations of CoWoS (Chip-on-Wafer-on-Substrate) packages that are currently deployed or being deployed in consumer and server space… Full article