The ASIC/SoC Design House is very proud to announce its integration to the TSMC Open Innovation Platform® and its program dedicated to Design Houses: Design Center Alliance.
The OIP aims to reduce design barriers and implementation time by providing tools and easier access to TSMC DCA members.
“With many years of practice making integrated devices using TSMC technologies, this is an exciting milestone for IC’Alps and we are very proud to be part of TSMC Design Center Alliance. We support hereafter our common customers in their ASIC design with a reassurance of meeting their needs on performance, time-to-market and budget. We will strive to honour this position.” Lucille Engels, Chief Operating Officer – IC’Alps
Our partnership with IC’Alps will benefit our mutual customers with its high-quality ASIC/SoC development services using TSMC’s technologies, as well as IC’Alps’ experience with European markets. As a valuable design ecosystem partner, IC’Alps has extensive IC design expertise and will be able to help our customers accelerate silicon innovation for a wide range of emerging technologies.” Head of the Design Infrastructure Management Division – TSMC