VerLASE reports progress with the manufacturing of MicroLED displays

VerLASE Technologies announced substantial progress in demonstrating its novel mass transfer process, which is the key impediment to microLED displays industry realizing its full potential. The process is based on a unique technology being developed by the Company called the Photo-Mechanical Actuation (PMA). The company asserts its process once fully implemented is capable of very high transfer thruput rates with high spatial accuracy. ”This is a pre-requisite for commercially viable production of microLED displays,” said VerLASE CTO Ajay Jain.

The deceptively simple solution utilizes a novel patent pending transfer stamp architecture along with novel chemistry to deterministically pick-up a large number of microdies, translate them to the desired drop-off location on a substrate and then dispense them with very high accuracy and speed. The chemistry is completely fab-compatible, like a photoresist. Further details can be found on the Company’s Website, as in

The Company’s plans to duplicate its process flow with an assortment of dies sizes from 200 X 200 sq. um for the mini-LED market, to 10 X 10 sq. um, before moving on to 5 X 5 sq. um, the ultimate goal for the large smartphone market at over 400 PPI. VerLASE plans to demonstrate the transfer of both flip-chip, and vertical thin film LED architectures.

The Company has also developed a novel (patent pending) holding tool to firmly secure the microLEDs in place while they are being worked on and release them vertically, on-demand, as needed.

Combined with the Company’s earlier work in Color Conversion, VerLASE presents a unique set of technologies for the coming future MicroLED displays.

The Company spun out of Versatilis with an investment by Wakley, a Hong Kong based private investment team, and operates with partners around the world. Founded by Versatilis’ principals George Powch (CEO) and Ajay Jain (CTO), it focuses on technology development for large markets of the near future involving novel materials, structures and processes.