Glass to enable next-gen IC substrates – An interview with Absolics

Glass materials are powering next-generation IC substrates for cutting-edge HPC and AI products.

The increasing demand for HPC and AI products has accentuated the complexity of requirements on IC substrate makers and pushed the limitations of organic IC substrates to reduce the development cycle for next-gen IC substrates in terms of finer L/S, larger form factors, thermal management, reliability challenges, and cost, to reach the industry goals in terms of computing power, reliability, power consumption, and cost. 

Glass core substrate technology is emerging and enabling next-gen technologies and products in two key semiconductor industries: advanced packaging and IC substrates. Both industries are set to take off with the increasing adoption of AI and HPC products. In 2023, the total advanced packaging market reached $ 37.8 billion, while the advanced IC substrates market reached $ 15.14 billion, as detailed in the new semiconductor packaging report from Yole Group: Status of the Advanced IC Substrate Industry. The second half of the current decade is expected to be impressive for both interconnected industries, and one of the crucial links will be glass core substrates, initially for the HPC and AI markets, followed by the other end markets.

By announcing the adoption of glass core substrates, Intel highlighted them as one of the technologies able to change the competitive landscape of the semiconductor packaging industry. Traditional organic substrates and silicon interposers have been the mainstay of the industry, but they are increasingly struggling to meet the demands of next-gen products. “Advanced Packaging giants like TSMC, Samsung, and Intel have been leaders in advanced packaging technologies, offering solutions such as CoWoS and I-Cube and EMIB,” explains Bilal Hachemi, Ph.D., Technology & Market Analyst, Semiconductor Packaging at Yole Group. “However, while effective, these technologies are nearing their performance limits from a substrate point of view. This has led to a business model adaptation and opened the door for new entrants, particularly in substrates.”

Absolics, a 2022 subsidiary of SKC, has quickly become a leader in glass core substrates, marking them as the first mainstream product in this field. This positions Absolics as a key player in meeting the rising demands of AI and HPC applications. Their leadership is further emphasized by their role in the first U.S. CHIPS Act project to support the semiconductor supply chain with this new technology.

To gain a deeper understanding of Absolics’ vision and strategy, Bilal Hachemi from Yole Group sat down with Chris Tipp, the Vice President of Sales and Marketing. In this interview, Chris shares his perspectives on the market dynamics, the unique advantages of glass substrates, and Absolics’ strategy to revolutionize the semiconductor industry.

Bilal Hachemi (BH): Please introduce your company to our readers?

Chris Tipp (CT): Absolics is an advanced packaging foundry service provider specializing in the manufacturing of glass substrates. In the era of artificial intelligence (AI), there is a growing demand for high-performance computing (HPC) capable of processing large volumes of data at high speeds. Traditionally, semiconductor performance has been enhanced through the miniaturization of front-end processes. However, this approach has recently encountered significant limitations, highlighting the increasing importance of back-end packaging. In this context, the glass substrates manufactured by Absolics are recognized as game-changers, poised to revolutionize the market by maximizing semiconductor performance.

Absolics is often associated with the term “No. 1” for several reasons. We are the first in the world to commercialize glass substrates for advanced semiconductor packaging. Additionally, we are leading the first project funded by the U.S. CHIPS Act, which aims to support the semiconductor supply chain by manufacturing this new advanced material. Furthermore, our parent company, SKC, was the first Korean company to invest in and establish a manufacturing facility in Georgia almost 30 years ago.

Bilal Hachemi (BH): Can you also tell us the story behind its creation?

CT: SKC began the development of glass substrates in earnest in 2018. Building on technical confidence in the commercialization process, SKC established Absolics in 2022. In the same year, Absolics broke ground on our facility in Covington, Georgia. As of 2024, the construction of the plant is complete, and we are currently in the process of developing samples.

BH: What is the added value of Absolics’ glass core substrate?

CT: The basic underlying technology replaces organic cored substrates with glass. Thanks to its smooth surface, a glass substrate can accommodate larger areas and hold more chips, allowing for fine routing work and enhancing chip-to-chip connections, resulting in enhanced performance. Additionally, the absence of an intermediate substrate makes it thinner and more power-efficient. By embedding MLCC within the substrate, it frees up surface space for more CPUs, GPUs, and memory, significantly boosting chipset performance.

Glass substrates improve performance for various reasons: their superior thermal conductivity, which enhances heat dissipation and potentially increases processing speed while reducing power consumption; a reduced form factor, as they can be thinner and lighter than organic alternatives, enabling more compact electronic designs; and enhanced reliability, given that glass is generally more stable and durable than organic materials, potentially resulting in longer-lasting and more reliable electronic components.

In an era where high-performance computing and AI are indispensable, glass substrates are poised to become game changers in the advanced packaging sector.

BH: What are the end markets that your solution could address?

CT: Based on the value that glass substrates bring to the market, the primary end markets will include AI servers, data centers, virtual reality, communications, and autonomous vehicles, where high-performance computing (HPC) packaging is essential.

BH: What applications are targeted by Absolics?

CT: Based on the benefits provided, the initial targeted markets will be larger form factor devices such as AI and high-performance computing packages.

BH: What is your view on the arrival of Glass to the advanced IC substrate landscape? Is it late or on time?

CT: I’d say it is late to market, but no one expected the explosion of demand in the AI space that has taken place. The power consumption of these chips is a real concern that needs to be addressed and glass substrate is one of the potential solutions to address it.

BH: Congratulations on receiving funding from the Chips Act. How will this funding help the development of Absolics?

CT: This funding will support the construction of Absolics’ Covington, Ga., manufacturing site and the commercialization of the company’s groundbreaking semiconductor material. This is the first proposed CHIPS investment in a commercial facility for semiconductor materials and manufacturing equipment.

BH: Absolics’ location is strategic for the US ecosystem. Does Absolics intend to work with local players or globally?

CT: Absolics aims to establish a novel ecosystem in advanced packaging, beginning in the United States. We are firmly committed to supporting and solidifying this ecosystem in the U.S. While the U.S. ecosystem is growing, this process cannot happen overnight. In our view, once solidified, our customers will not only target the U.S. market but will also expand to the global market, leveraging the robust U.S. ecosystem. This is a global business that will always require a global perspective. Throughout this business journey, Absolics anticipates engaging with various stakeholders and players, but these discussions will take place after successfully setting up the U.S. ecosystem. Our immediate and primary goal is to establish and solidify the U.S. ecosystem.

BH: In your opinion, what are the most promising applications that Glass Core Substrate needs to address to grow significantly?

CT: It is the chip-to-chip interconnect. Because of the flatness, getting multiple RDLs to 2um and below differentiates the technology enough to make it very difficult for organic substrate to compete, while it also competes with Si Interposers.

BH: When do you expect the adoption of glass core substrate to peak?

CT: Currently, in the realm of advanced packaging, CoWoS (Chip-on-Wafer-on-Substrate) stands as the sole solution. However, the market’s expectations have evolved beyond this single option, driving the demand for new and superior alternatives. Based on the current industry outlook, we anticipate that the demand for glass substrates will continue to rise.

Glass core substrates offer several technical advantages over traditional silicon and organic substrates. They provide better dimensional stability, lower thermal expansion, and superior electrical insulation. These characteristics are critical as we push for higher performance in electronic devices, with increased density and complexity of interconnects. Furthermore, glass substrates enable better thermal management and can support finer feature sizes, which are essential for advanced node technologies.

Although pinpointing the exact timing of peak adoption is challenging, we foresee substantial advancements and increased uptake of glass core substrates. As the industry continues to pursue higher performance, enhanced thermal management, and improved miniaturization capabilities, glass core substrates are likely to become a cornerstone of next-generation packaging solutions.