Advanced packaging: Yole announces strong momentum driven by the giants, TSMC, Intel and Samsung
“Advanced packaging has entered its most successful era boosted by the need for better integration, the slowdown of Moore’s law, and, beyond that, specific industry mega-drivers,” asserts Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea from Yole Développement (Yole). “These new trends create business opportunities for the various packaging platforms. Indeed, advanced packaging technologies are ideal for fulfilling the various performance requirements and complex heterogeneous integration needs…“
Yole and System Plus Consulting have been covering advanced packaging for a long time now. Step by step, they have developed deep technical and market expertise and present a valuable vision of this industry with an impressive collection of reports, including Status of the Advanced Packaging Industry report and a dedicated Quarterly Market Research Monitor.
The total IC packaging market was worth US$68 billion in 2019. In parallel, the advanced packaging industry was US$29 billion in 2019 and is expected to grow at a CAGR2019-2025 of 6.6% to reach US$42 billion in 2025, states Yole in its new Status of the Advanced Packaging Industry report, 2020 edition. Due to the strong momentum in the advanced packaging market driven by a slowing Moore’s Law and heterogeneous integration along with various megatrends, including 5G, AI, HPC, IoTs, etc., the share of advanced packaging in the overall semiconductor market is increasing continuously. According to Yole, it will reach almost 50% of the market by 2025.
At the same time, the traditional packaging market will grow at CAGR2019-2025 of 1.9% and total packaging market will grow at CAGR2019-2025 of 4% to reach US$43 billion and US$85 billion, respectively.
“Due to COVID-19 pandemic, the global advanced packaging market will decrease by 7% in 2020, while the traditional packaging market will decrease by 15%,” adds Santosh Kumar from Yole… More info.