Announcement of capital on investment plan for IC packaging substrate
We are announcing today, April 27 of 2021, that our capital investment has been planned for enhancement of production capacity in IC PKG substrates in order to meet the increasing demand for servers and image processing units from our Customer.
Outline of capital investment】
- Objective: Enhancement of production capacity in high-performance IC PKG substrates
- Amount: JPY180 billion (estimation basis)
- Place: IBIDEN Gama Plant (3-200 Gama-cho, Ogaki-City, Gifu Pref.)
- Start of production: To be first started within 2023, then shifted finally to high-volume manufacturing
- Production capacity: Enhancement production capacity for demand of IC PKG substrates expected to increase from FY2023
- Three stages to start of production:
- 1st stage: Start of demolition of existing building, removing of facilities and equipment (First half of FY2021)
- 2nd stage: Start of construction of new production building (Second half of FY2021)
- 3rd stage: Completion of new production building and start of high-volume manufacturing (FY2023)