“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” announces Yole Développement
“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with FOPLP technology. Both companies have invested and developed FOPLP for production successfully in 2018.” Under this dynamic context, advanced packaging companies are re-defining strategies to improve their market positioning or maintain their leadership. As a consequence, the supply chain is directly impacted and business models are thereby evolving. The Fan-Out packaging landscape of today is more fragmented than ever…
Yole Group of Companies including Yole and System Plus Consulting pursue its investigations towards the advanced packaging technologies and propose a significant collection of reports dedicated to Fan-Out. More than a simple description, reports performed by both partners are comprehensive analyses of the industry evolution, market trends and technology challenges.
Fan-Out Packaging: Technologies and Market Trends report and Advanced Packaging Technology in the Apple Watch Series 4 are the latest reports related to the Fan-Out technologies and proposed by the Yole Group of Companies.
Stéphane Elisabeth, PhD, Expert Cost Analyst at System Plus Consulting comments: “With the Apple Watch Series 4, the leading company has chosen to collaborate with many innovative partners including TSMC. Therefore, the application processor (AP) packaging is based on TSMC’s integrated Fan-Out (inFO) technology in the last version, called inFO-ePoP coupling Multi Chip Memory with the AP.”
With these new reports, Yole Group updates the business status of Fan-Out technologies markets with forecasts and roadmaps definition, competitive landscape, reverse engineering and costing analyses… and points out the technical challenges and impact on the supply chain. A detailed description of the advanced packaging reports is available on i-micronews.com, advanced packaging reports section.
In 2015, the Fan-Out market was small and consisted mostly of standard devices like BB , RF , and PMU . But after TSMC’s 2016 game-changer with inFO for Apple’s iPhone APE, market value increased 3.5x by 2017. Thus the HD Fan-Out market segment was created, reducing the market-share ratio of OSATs … More info.
Sources: www.yole.fr – www.systemplus.fr