YG PRESS NEWS – Advanced packaging industry: towards a Q2 2023 recovery?

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Following a sluggish performance in the first quarter, advanced packaging revenues are anticipated to bounce back with an 8% recovery in Q2 2023.

  • Advanced packaging (AP) revenue is expected to grow at a 10% CAGR, from US$44.3 billion in 2022 to US$78.6 billion by 2028
  • AP revenues have grown 10% in 2022 compared to the previous year.
  • Flip-chip BGA, flip-chip CSP and 2.5D/3D are the dominating packaging platforms in terms of revenues.
  • AP units are expected to show a 6% CAGR2022-2028, with WLCSP, SiP and FCCSP leading in terms of the total number of units.

According to Yole Intelligence, part of Yole Group, in the Advanced Packaging Market Monitor, despite the soft demand in several end-markets, package manufacturers have experienced a prolonged inventory digestion, leading to declining utilization rates in the first half of 2023. This resulted in a 19% decline in revenues during Q1-23, but a slightly stronger performance is expected in Q2-23, with more significant recovery anticipated in the second half of the year.

The semiconductor industry is facing a challenging year in 2023, with the AP market projected to grow only around 0.8%, reaching a total of $44B. Revenues in the AP market are expected to show slight growth for 2.5D/3D, FCBGA, and FO packaging. However, other platforms are likely to experience revenue decreases, primarily due to weak demand in the mobile and consumer markets. Looking ahead, starting from 2024 and in the coming years, the AP market’s growth will be driven by the AI hype generated by the surge in generative AI applications like ChatGPT. The adoption of such AI technology will be crucial for devices like CPUs, GPUs, FPGAs, and HBM… For more information about this analysis, please contact us!

Titre du visuel

june 2021

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