YG PRESS NEWS – High-end performance packaging industry: a massive expansion on the horizon

According to Yole Intelligence, part of Yole group, in the High-end Performance Packaging 2023 report, the primary technological trend observed in high-end performance packaging platforms involves the reduction of interconnection pitch, regardless of the specific type. This applies to technologies such as TSVs (Through-Silicon Vias), TMVs (Through Mold Vias), microbumps, and even hybrid bonding, which is currently the most advanced solution. Additionally, there is an expectation of decreasing the via-diameter and wafer thickness. This technological advancement is crucial for accommodating the integration of more complex monolithic dies and chiplets. It enables faster data processing and transmission, while simultaneously reducing power consumption and loss. Moreover, it facilitates higher density integration and bandwidth for future generations… For more information about this analysis, please contact us!