YG PRESS NEWS – The power module packaging market will double its growth by 2028
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With a CAGR of 10%, EV/HEV is transforming the power module packaging market, reaching $4.1 billion in 2028.
- The cost of raw materials for power module packaging will represent about 28% of total power module cost by 2028.
- EV/HEV applications continue to drive the technology trends in power module packaging.
- How will the supply chain be impacted by the evolution of packaging technologies?
The power module is one of the key elements in power converters and inverters. The market for power modules will reach $14.8 billion by 2028, with a 2022 – 2028 compound annual growth rate (CAGR) of 12.8%. By 2028, the power module packaging raw materials market will have a value of almost $4.1 billion, representing close to 28% of total power module cost. This market’s promising outlook is beneficial for the power module packaging material business, which Yole Intelligence covers in this report. Analysts look closely at the substrate, baseplate, die-attach, substrate-attach, encapsulation, interconnection, and thermal interface material (TIM) markets in terms of technology, supply chain and market forecasts. In 2022, the largest packaging material segment was for baseplates (25% of total market), followed by substrates (23% of total market). The other 28% of this market is represented by die-attach and substrate-attach materials. The major technological choices in these segments can rapidly impact the overall power module packaging market. For example, the market share for silicon nitride as a substrate is increasing, driven primarily by EV/HEVs. This technology is pricier than more conventional aluminium oxide substrates… For more information about this analysis, please contact us!
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june 2021You have to be registered to download our medias.
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Related event
APEC 2023 – APPLIED POWER ELECTRONICS CONFERENCE – Yole Group will be part of the Industry Session with Elena Barbarini, Semiconductor Devices Department Director at Yole SystemPlus part of Yole Group. She will present State of the Art of SiC Transistors and Modules: Technology and Cost Overview on Tuesday, March 21 during the Industry Session Chair Session: Other Perspectives of Power Electronics – Markets, Society and Policies at 09:20am – 09:45am ET. In addition, Milan Rosina, Principal Analyst, Power Electronics & Battery Yole Intelligence part of Yole Group. He will present EV Powertrain Trends – Now and in the Future on Tuesday, March 21, during the Other Perspectives of Power Electronics – Markets, Society and Policies Session, at 08:55am – 09:20am ET. at Yole Intelligence part of Yole Group. More info coming soon…