Advanced Packaging Market Monitor

Key Features

• Direct access to the analyst
• Packaging industry dynamics highlights and analyst viewpoint
• Quarterly data on key advanced package types: FCCSP, FCBGA, WLCSP/Fan-In, Fan-Out, 3D-stacked, and SiP
• Market forecast through 2029, in $US, units and wafers
• Average Selling Price (ASP) analysis
• End-product/device application mix
• Supplier market shares for TSMC, Intel Samsung Electronics, Amkor, JCET, ASE w/SPIL, PTI, Nepes, SPIL, Huatian, TFME, SK Hynix and Sony
• Advanced Packaging Capex

What's new

• Packaging revenue rankings for 2023
• Advanced vs. Traditional packaging market update
• New investments and technology announcements
• Advanced packaging platforms market shares for 2023

Product objectives

• Provide short-term market dynamics on a quarterly basis for several advanced packaging platforms: Fan-Out, Fan-In/WLCSP, FCCSP, FCBGA, 2.5D/3D and SiP.
• Provide capital expenditures (CapEx) and capacity figures per major player.
• Provide market shares of leading OSATs/Foundries/IDMs.
• Provide package ASP figures per given market/platform.
• Provide recent news and strategic moves of key players over the last quarter.

Available on our Yole Group All-Inclusive Packaging Package

Advanced packaging revenue increased 4% in Q4 2023 contributing to a stronger second half of the year

Advanced packaging revenue reached $10.7B in Q4-2023, showing a slight increase of 4% quarter-over-quarter. Although demand is still soft and customers’ inventories are being further digested, 2024 is set to be a year of recovery. Q1 2024 is expected to show the weakest results of the year, decreasing by 13% quarter-over-quarter to $9.1B. In terms of CapEx, Q4 2023 showed increases for most companies compared to the preceding quarter. Q4 2023 was marked by significant domestic and overseas investments in advanced packaging, including announcements from companies like Silicon Box, ASE, JCET, TSMC, Raytheon, and NHanced Semiconductors. Many are investing in the generative AI space, showing the need for more capacity and more complex packaging technologies. 2023 ended with the top players – including OSATs, IDMs, and foundries – investing ~ $9.9B in CapEx in advanced packaging activities, a decrease of 21% compared to 2022.

Advanced packaging set to reach $69.5B in 2029, propelled by generative AI

Advanced packaging revenue is expected to experience a 10.7% CAGR from $37.8B in 2023 to $69.5B in 2029. 2023 was, in general, a weaker year for the overall semiconductor industry, and the advanced packaging market was also affected. Nevertheless, the market is set to recover in 2024 as demand increases and the adoption of advanced packaging continues to grow. The advanced packaging market is mainly driven by the mobile and consumer, telecom and infrastructure, and automotive markets, pushed by megatrends like HPC and generative AI. Within all packaging platforms, 2.5D/3D packaging will grow fastest over the next five years. Industry giants like TSMC, Intel, and Samsung, along with top OSATs like ASE, Amkor, and JCET, are investing heavily in advanced packaging technology and capacity and together are expected to invest ~$11.5B in 2024 in their advanced packaging businesses.

Advanced Micro Devices (AMD), Amkor Technology, Apple, Applied Materials, Aptos Technology, ASE, Authentec, Broadcom, Calumet Electronics, China Resources Microelectronics, China WLCSP, Chipbond, ChipMOS, Deca Technologies, ECHINT, Foxconn, GlobalFoundries, Global Unichip Corp (GUC), Hana Micron, Inari Berhad, Infineon, Intel, JCET, JSI, Kaynes SemiCon, King Yuan, Kyocera, Longsys, Luxshare ICT, Micron, Murata, Nepes, NHanced Semiconductors, NVIDIA, PCB Technologies, Powertech Technology, Qorvo, Qualcomm, Raytheon, Renesas, Samsung Electronics, Samsung Electro-Mechanics, SEALSQ, Schmid Group, Shinko Electric, ShunSin, Silicon Box, SK Hynix, SkyWater, Skyworks, SPIL, Sony, Stars Microelectronics, ST Microelectronics, Taiwan Semiconductor Manufacturing Company, Taiyo Yuden, TDK, Texas Instruments, TianShui Huatian, Tongfu Microelectronics, United Microelectronics Corporation, Universal Scientific Industrial (USI), UTAC, Western Digital, Winbond, Wisol, Yangtze Memory Technologies Corp, and more.

Glossary

Key Terms and Definitions As Used In This Monitor

Advanced Packaging Monitor Scope

Advanced Packaging Monitor – Market Segmentation

Advanced Packaging Monitor Methodology

About The Authors

Companies Cited

Advanced Packaging Platform Definitions

What Has Changed This Quarter

Packaging Industry Highlights

Capex Highlights – Investment and Expansion

Analyst Commentary: Market Dynamics

Key Market Metrics At A Glance

• Advanced Packaging Market Dynamics – Revenue
• Advanced Packaging Market Dynamics – Volume
• Advanced Packaging Market Dynamics – Wafer
• Advanced Packaging Market Dynamics – Quarterly
• Advanced Packaging Revenues of Top Players

Fan-out Market Dynamics

• Short-term Fan-out Package Overview
• Long-term Fan-out Package Overview
• Short-term Fan-out Package Revenue By End-Market
• Short-term Fan-out Package Shipments By End-Market
• Fan-out Package Shipments by Supplier
• Fan-out Package Revenue by Supplier
• Fan-out Package Pricing Dynamics
• UHD FO, HD FO, and Core FO Wafer Forecast (300mm Eq.)
• UHD FO, HD FO, and Core FO Revenues
• Fan-out Wafer And Panel Revenue: UHD FO, HD FO, Core FO
• Fan-out Package Device Mix

WLCSP Market Dynamics

• Short-term WLCSP dynamics
• Long-term WLCSP dynamics
• Short-term and Long-term WLCSP dynamics
• Short-term and Long-term WLCSP Shipments
• Short-term and Long-term WLCSP Revenue
• Short-term WLCSP Shipments by Supplier
• Long-term WLCSP Revenue by Supplier
• WLCSP Pricing Dynamics
• WLCSP Application Mix

FCBGA Packaging Market Dynamics

• Short-term FCBGA Package Overview
• Long-term FCBGA Package Overview
• Short-term FCBGA Wafer Demand by End-Market
• Short-term FCBGA Package Shipments by End-Market
• Short-term FCBGA Package Revenue by End-Market
• FCBGA Package Shipments by Supplier
• FCBGA Packaging Service Revenue by Supplier
• FCBGA Wafer Bumping Revenue by Supplier
• FCBGA Package Pricing Dynamics
• FCBGA Package Device Mix

FCCSP Packaging Market Dynamics

• Short-term FCCSP Package Overview
• Long-term FCCSP Package Overview
• Short-term FCCSP Wafer Demand by End-Market
• Short-term FCCSP Shipments by End-Market
• Short-term FCCSP Revenue by End-Market
• FCCSP Shipments By Supplier
• FCCSP Packaging Service Revenue By Supplier
• FCCSP Wafer Bumping Revenue By Supplier
• FCCSP Package Pricing Dynamics
• FCCSP Device Mix

2.5D and 3D-stacked Packaging Market Dynamics

• Short-term 2.5D/3D-stacked Package Overview
• Long-term 2.5D/3D-stacked Package Overview
• 2.5D/3D-stacked wafer demand by technology
• 2.5D/3D-stacked shipments by technology
• 2.5D/3D-stacked revenues by technology
• Short-term 2.5D/3D-stacked Shipments by End-Market
• Short-term 2.5D/3D-stacked Revenue by End-Market
• 2.5D/3D-stacked Shipments by Supplier
• 2.5D/3D-stacked Revenue by Supplier
• 2.5D/3D-stacked Package Technology Mix 

Scope Of Module: SiP

SiP Market Dynamics

• Short-term SiP Package Overview
• Long-term SiP Package Overview
• Short-term SiP Dynamics By Market Segment: Shipments
• Short-term SiP Dynamics By Market Segment: Revenue
• SiP Production By Supplier
• SiP Supplier Market Shares And Forecast: Revenue
• SiP Application Mix

Supplier Details

• TSM
• TSMC
• UMC
• Intel
• Sony (Stacked CIS)
• Samsung Electronics
• Micron
• SK hynix
• YMTC
• ASE (w/Usi and w/SPIL)
• JCET
• Amkor
• PTI
• TFME
• TianShui Huatian

Conclusions

Yole Group Corporate Presentation