Lithography and Bonding Equipment 2022 - Focus on More Than Moore

Key Features

• New applications in scope: Power IC, Photonics and Die-to-wafer (D2W) Bonding
• Technology trends for photolithography and bonding equipment
• Market trends for photolithography and bonding equipment
• Photolithography and bonding process supply chain status
• 2021-2020 YoY revenue evolution for photolithography and bonding equipment vendors
• Six-year equipment market forecast for 2020-2027 for photolithography and bonding applications with breakdowns by application and technology 

What’s new

• Application scope is enlarged into photonics, power IC and D2W hybrid bonding
• Advanced Packaging section is revised: IC substrate is removed while D2W bonder for hybrid/fusion bonding is added
• Scope is enlarged by high precision die attach equipment vendors
• Market study:
  • 2021 revenue and 2021-2020 YoY revenue evolution
    • Photolithography leaders’ revenues for More Moore and More than Moore applications
  • Six-year equipment market forecast: 2020 to 2027
• Supply chain and status for photolithography and bonding market is analyzed
• Subparts are analyzed

Product objectives

• Scope
  • Technology overview and equipment benchmark
  • Equipment market size update
  • Market share and YoY revenue evolution
  • Photolithography and bonding process supply chain overview
• Context
  • Analyze equipment needs during post-pandemic shortages
  • Geopolitics’ influence on semiconductor equipment
• Perspective
  • Technology perspective an inflation points
  • Market perspective and six-year forecast for 2020-2027

3M, Alpha Tools, Applied Microengineering (AML), Advanced System Technology (AST),Adtec Engineering, ASML, ASM Pacific Technologies, Ayumi Industry, Applied Materials, Be Semiconductor Industries N.V. , Bondtech, Brewer Science, Canon, Coherent, Cuon Solution, Delphi Laser, DISCO, Dynatech, Eo Technics, ERS Electronic, Eshylon Scientific, EV Group (EVG), Hakuto, Heidelberg Instruments, Hanmi, Kingyoup Optronics, KLA / Orbotech, Kulicke & Soffa (Liteq), Japan Science Engineering, NIDEC, Nikon, Onto Innovation, Orbotech, ORC Manufacturing, Patrow Technologies, Scientech Technologies, Semiconductor Solutions Co., Ltd. (SCREEN), SEMES, Shanghai Micro Electronics Equipment Co (SMEE), Shibaura Machine, Shin-Etsu, SUSS MicroTec, Sy&Se, Takatori Corporation, TAZMO, Tokyo Electron (TEL), Tokyo Ohka Kogyo (TOK), Toray, Ushio, Veeco, Xperi and more.

Glossary and definitions

Table of contents

What’s in the report?

Report scope

Report methodology

About the author 

Companies cited in this report

What we got right, what we got wrong

Who should read this report?

Three-page summary 

Executive summary

• Lithography
• Permanent bonding
• Temporary bonding

Report scope and methodology

Context 

Photolithography  

• Photolithography equipment market forecasts
• Photolithography leaders – revenue evolution
• Photolithography technology and equipment vendors
  • Photolithography exposure technology 
  • Focus on laser direct imaging/maskless lithography
  • Photolithography equipment vendors

Photolithography equipment for components

• MEMS and Sensors
• Power devices
• RF devices
• CMOS image sensor devices
• Photonic devices
• Advanced packaging
  • Heterogenous integration and hybrid bonding
  • Fan-Out
  • IC Substrate / advanced substrate

Permanent bonding equipment market

• Technology
• Forecasts
• Permanent bonding equipment for components
  • Hybrid and fusion bonding
    • Technology adoption
    • Equipment: front-end vs back-end
    • W2W technology and equipment vendors
      • Focus on CMOS image sensors
      • Focus on logic and memory
    • D2W technology and equipment vendors
    • Co-D2W technology and equipment vendors
  • MEMS and sensors
  • Engineered substrates
    • Emerging applications: SiC

Temporary Bonding equipment market 

• Technology
  • Emerging applications: photonic devices
• Equipment
• Forecasts

Conclusion

Yole Group corporate presentation

More than Moore manufacturers’ appetite for lithography and bonding equipment is growing

In 2020, lithography and bonding equipment revenue totaled $1.7B.  This includes new application segments in the 2022 report update, power ICs, photonics and die-to-wafer (D2W) hybrid bonding. 2020 revenue comprises $1.3B for lithography, $261M for wafer-to-wafer (W2W) permanent bonding, $6M for D2W hybrid bonding and $113M for temporary bonding. The YoY change and projection towards 2027 is shown in Figure 1. Regarding YoY growth, 2021 totaled $2B, up 18%. Lithography equipment grew 12% YoY and W2W permanent bonding equipment grew 29% YoY. D2W hybrid bonding equipment recorded impressive 200% YoY growth and temporary bonding equipment grew 34% YoY.

Looking forward, we expect positive equipment market growth with a reasonable 8% Compound Annual Growth Rate (CAGR) for 2020-2027. The market will reach $2.8B in 2027, driven by increasing wafer volumes to be processed across all applications considered, see Figure 2. Semiconductor chip manufacturers concerned, specifically Integrated Device Manufacturers (IDMs), foundries and Outsourced Semiconductor Assembly and Test (OSAT) companies, will also expand their capacity. The highest CAGR of 69% is expected for D2W hybrid bonding, due to AMD, Intel, Micron, Sk Hynix and Samsung adopting this technology. Hybrid and fusion bonding drives also growth of W2W permanent bonding market with relatively high 16% CAGR. W2W technology serves 3D stacking and integration of CMOS Image Sensors (CIS), 3D NAND memory, Artificial Intelligence (AI) processors, MicroElectroMechanical Devices (MEMS) and engineered substrates. Temporary bonding will grow with more moderate 7% CAGR serving advanced packaging applications such as fan-out, thinning and 3D integration across memory devices and compound semiconductors. Finally, photolithography growth (5% CAGR towards $1.9B in 2027) is driven by production capacity expansions across advanced packaging and More than Moore applications for i-line and deep ultraviolet (DUV) steppers and scanners. In advanced packaging, Laser Direct Imaging is used for integrated circuit substrates and Fan-out while i-line steppers are used for fan-out, Wafer Level Packaging (WLP), 2.5D and 3D stacking.

Market share distribution varies between lithography and bonding equipment businesses

2021 was yet another consecutive record revenue year for lithography and bonding equipment vendors, despite ongoing supply chain issues. Regarding the players considered in Figure 3, similarly as of the 2020 calendar year, Canon is the lithography market leader followed ever more closely by ASML. EVG is the market leader for both W2W permanent and temporary bonding. In the W2W permanent bonding business, EVG is followed by Tokyo Electron Limited (TEL), both serving CIS as well as 3D integration and stacking. In the temporary bonding business, EVG is followed by SUSS MicroTec, which is gaining recognition for memory thinning.  Finally, D2W hybrid bonding requires die attach or flip-chip equipment type from players such as Besi, Shibaura, Smart Equipment Technology and ASM Pacific Technology for instance. Among them, although Besi is a newcomer it is the market leader, followed by Shibaura, whose tools have been used for this application for several years.