Market and Technology Trends
Status of the Advanced Packaging Industry 2022
By Yole Intelligence —
New players are disrupting the $37.4B advanced packaging market, investing hugely into new promising technologies with risky return-on-investment
Status of the advanced packaging industry 2022
- Glossaries
- About the authors
- Report’s objectives
- Scope of this report
- Methodology
- What we got right, what we got wrong
Three-page summary
Executive summary
Noteworthy news on advanced packaging
Semiconductor industry context
Advanced packaging market trends
Advanced packaging platforms summary
Advanced packaging technology trends
- Technology trends: focus on TSMC
- Technology trends: focus on samsung
- Technology trends: focus on intel
- Technology trends: focus on ASE
- Chiplet and heterogenous integration trends
- Hybrid bonding
- Advanced packaging equipment & material suppliers
Players and supply chain
- Substrate shortage issues
Financial analysis
Mergers & acquisitions
Conclusions
Yole Group - corporate presentation
AMD, Amazon, Amkor, AOI Electronics, Applied materials, Ardentec, Arm, ASE, ASM, Besi, Carsem, China Resources Microelectronic, China WLCSP, Chipmore Technology, ChipMOS, Chippacking, Deca, Forehope, Formosa Advanced Technologies, ESWIN, GlobalFoundries, Global Unichip Corporation, Google, Graphcore, Greatek Electronics, Hana Micron, Hanmi, HiSilicon, Inari Berhad, Infineon, Institute of Microelectronics, Intel, JCET, King Yuan Electronics, LB Semicon Inc., Lingsen Precision Industries, Meta, Micron, Microsoft Corporation, Murata, Nepes, Nvidia, Orient Semiconductor Electronics, Payton Technology, Powertech Technology, Qorvo, Qualcomm, Samsung Electronics, Semco, SFA Semicon, Shibaura, Sigurd Microelectronics, SkyWater, Smart Equipment Technology, Sony, SK Hynix, Skyworks, Taiyo Yuden, Taiji Semiconductor, Texas Instruments, TianShui Huatian, Tong Hsing, Tongfu Microelectronics Co., Ltd., Tower Semiconductor, TSMC, UMC, Unisem Berhad, UTAC, Walton Advanced Engineering, Wisol, Xinhuicheng, YMTC, Ziguang Hongmao and more.
Advanced Packaging (AP) Market Trends
In 2021, the AP market represented 44% of the total Integrated Circuit (IC) packaging market. There is strong momentum in the AP market driven by megatrends. The share of AP in the total semiconductor market is therefore increasing continuously. It will reach more than 50% of the market by 2027. The highest AP market share belongs to Flip-Chip (FC) platform, which includes FC Ball Grid Array (FCBGA), FC Chip Scale Packaging (FCCSP) and FC Systems-in-Packages (FC-SiPs) with 70% of the market in 2021. The highest revenue Compound Annual Growth Rate from 2021-2027 (CAGR2021-2027) is expected from Embedded Die (ED) in laminate substrates, 2.5D/3D, and fan-out at 24%, 14% and 11%, respectively, as high-volume products further penetrate the market.
AP Technology Trends
Technology node scaling is no longer the only semiconductor driver. New markets and applications are developing with an emphasis on device functionality and AP is becoming crucial for semiconductor innovation. AP is seen to increase the value of a semiconductor product, adding functionality, maintaining or increasing performance while lowering cost. Big Integrated Device Manufacturers (IDMs) and foundries are the pioneers of Moore’s Law. They mainly relied on front-end scaling for performance improvements. Now, they are increasingly looking at heterogeneous integration using AP technology to complement their front-end effort.
Supply chain players
Outsourced Semiconductor Assembly and Test (OSAT) companies accounted for 65% of the AP wafers produced in 2021. Foundries are taking AP business from OSATs. Six players, including two IDMs, Intel and Samsung, a foundry, TSMC, and the top three global OSATs, ASE, Amkor and JCET, process over 80% of AP wafers.
Key Features
- News on advanced packaging – government investment, collaboration activities, investment and capability expansion, new technologies and products
- Advanced Packaging market forecast through 2027, in $US, units and wafers
- Advanced Packaging technology and key player trends
- Advanced Packging supply chain and substrate shortage issue
- Top 30 OSAT financial analyses, including breakdown of Chinese OSATs
- Mergers and acquisitions since 2020 and explanatory scenarios
What's new
- News in advanced packaging updated and segmentized into fewer categories
- Updated technology trends
- Updated Advanced Packaging equipment and material suppliers
- Updated a comparison of Advanced Packaging key players
- Financial analysis including top 33 players
- Financial analysis of top 10 Chinese OSATs
Product objectives
Advanced Packaging market overview
- Drivers and dynamics
- Future applications
- Disruptions and opportunities
Supply chain analysis
- Overview of production by IDM, OSAT and foundry players
- Shifting business models
- Financial analysis of top 30 OSATs
Technology trends and forecasts
- Revenue, wafer, and unit forecasts by platform
- Future development by platform
- Impact of front-end scaling
- Scaling and functional roadmaps
Available on our Yole Group All-Inclusive Semiconductor Packaging Package