Market and Technology Trends

Advanced Packaging Market Monitor

By Yole Intelligence

In 2022, top players’ capital expenditure will grow 22% to reach $15.3B from $11.9B in 2021, strengthening their position in the advanced packaging market.

Key Features

  • Direct access to the analyst providing opportunity for Q&A
  • Packaging industry dynamics highlights and analyst viewpoints
  • Quarterly data update on key advanced package types, including FCCSP, FCBGA, WLCSP/Fan-In, Fan-Out packages, 3D-stacked packages, and SiP
  • Market forecast through 2027 in $US, units and wafers
  • ASP analysis per market segment
  • End-product device application mix
  • Key process technology mix
  • Supplier market shares for TSMC, Semco, Samsung Electronics, Amkor, JCET, ASE w/SPIL, PTI, Nepes, SPIL, Huatian, TFME, SK Hynix and Sony
  • Demand forecast through 2027, by category including mobile, consumer, telecom, and infrastructure
  • Capex and capacity per supplier

What's new

  • End-system unit volumes were updated in all modules
  • 2022 Packaging CapEx was updated, and additional analysis is provided
  • 3DSoC, 3D-stacked memory and Si Interposer forecasts were updated by reviewing KWSPY number
  • AiP, PAM and FEM forecasts were updated on SiP forecast
  • Update on the OSAT industry dynamics for Q3-22
  • New investments and new commercial products using advanced packaging have been announced or released

Product objectives

  • The Fan-Out, WLCSP/Fan-In, 3D Stacked, FCBGA, FCCSP and SiP markets
  • Near-term market dynamics on a quarterly basis
  • Long-term market dynamics for 2021-2027
  • Capex and capacity per major player
  • Market shares of leading OSATs, foundries and IDMs
  • Package ASP per given market and platform

Available on our Yole Group All-Inclusive Packaging Package

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