Market and Technology Trends

Advanced Packaging Market Monitor

By Yole Intelligence

In 2022, top players’ capital expenditure will grow 34% to reach $16B from $11.9B in 2021, strengthening their position in the advanced packaging market.

Key Features

  • Direct access to the analyst providing opportunity for Q&A
  • Packaging industry dynamics highlights and analyst viewpoints
  • Quarterly data update on key advanced package types, including FCCSP, FCBGA, WLCSP/Fan-In, Fan-Out packages, 3D-stacked packages, and SiP
  • Market forecast through 2027 in $US, units and wafers
  • ASP analysis per market segment
  • End-product device application mix
  • Key process technology mix
  • Supplier market shares for TSMC, Semco, Samsung Electronics, Amkor, JCET, ASE w/SPIL, PTI, Nepes, SPIL, Huatian, TFME, SK Hynix and Sony
  • Demand forecast through 2027, by category including mobile, consumer, telecom, and infrastructure
  • Capex and capacity per supplier

What's new

  • End-system unit volumes were updated in all modules
  • Penetration rate of FCCSP in DRAM was updated
  • SiP forecast was updated as PA module and FEM units were revised
  • 2.5D/3D forecast was updated as embedded silicon bridge units and CIS wafer volumes were revised
  • TSMC, Intel and Samsung were added to packaging player revenue and YoY growth ranking
  • New investments and commercial products using advanced packaging were announced
  • 2022 capex of packaging top players was updated

Product objectives

  • The Fan-Out, WLCSP/Fan-In, 3D Stacked, FCBGA, FCCSP and SiP markets
  • Near-term market dynamics on a quarterly basis
  • Long-term market dynamics for 2021-2027
  • Capex and capacity per major player
  • Market shares of leading OSATs, foundries and IDMs
  • Package ASP per given market and platform
  • Device and application adoption for advanced packaging technologies

 

Available on our Yole Group All-Inclusive Packaging Package

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