Advanced Packaging Market Monitor

Glossary

Key Terms and Definitions As Used In This Monitor

Advanced Packaging Monitor Scope

Advanced Packaging Monitor – Market Segmentation

Advanced Packaging Monitor Methodology

About The Authors

Companies Cited

Advanced Packaging Platform Definitions

What Has Changed This Quarter

Packaging Industry Highlights

Capex Highlights – Investment and Expansion

Analyst Commentary: Market Dynamics

Key Market Metrics At A Glance

• Advanced Packaging Market Dynamics – Revenue
• Advanced Packaging Market Dynamics – Volume
• Advanced Packaging Market Dynamics – Wafer
• Advanced Packaging Market Dynamics – Quarterly

Fan-out Market Dynamics

• Short-term Fan-out Package Overview
• Long-term Fan-out Package Overview
• Short-term Fan-out Package Revenue
• Fan-out Package Revenue by Supplier
• Fan-out Package Pricing Dynamics
• UHD FO, HD FO, and Core FO Wafer Forecast (300mm Eq.)
• Fan-out Wafer And Panel Revenue: UHD FO, HD FO, and Core FO
• Fan-out Package Application Mix

WLCSP Market Dynamics

• Short-term WLCSP dynamics
• Long-term WLCSP dynamics
• Short-term and Long-term WLCSP dynamics
• Short-term and Long-term WLCSP Shipments
• Short-term and Long-term WLCSP Revenue
• Short-term WLCSP Shipments by Supplier
• Long-term WLCSP Revenue by Supplier
• WLCSP Pricing Dynamics
• WLCSP Application Mix

FCBGA Packaging Market Dynamics

• Short-term FCBGA Package Overview
• Long-term FCBGA Package Overview
• Short-term FCBGA Wafer Demand
• Short-term FCBGA Package Shipments
• Short-term FCBGA Package Revenue
• FCBGA Package Shipments by Supplier
• FCBGA Package Revenue Market Shares
• FCBGA Package Pricing Dynamics
• FCBGA Package Application Mix

FCCSP Packaging Market Dynamics

• Short-term FCCSP Package Overview
• Long-term FCCSP Package Overview
• Short-term FCCSP Wafer Demand
• Short-term FCCSP Shipments
• Short-term FCCSP Revenue
• FCCSP Shipments Split By Supplier
• 2022 FCCSP Packaging Service Revenue Market Shares
• FCCSP Revenue Split By Supplier
• FCCSP Package Pricing Dynamics
• FCCSP Application Mix

3D-stacked Packaging Market Dynamics

• Short-term 3D-stacked Package Overview
• Long-term 3D-stacked Package Overview            
• 3D-stacked IC Package wafer demand by technology
• 3D-stacked IC Package units by technology
• 3D-stacked IC Package revenues by technology
• Short-term 3D-stacked IC Package Shipments
• Short-term 3D-stacked IC Package Revenue
• 3D-stacked IC Shipments by Manufacturer
• 3D-stacked IC Revenue by Supplier
• 3D-stacked Package Application Mix

Scope Of Module: SiP

SiP Market Dynamics

• Short-term SiP Package Overview
• Long-term SiP Package Overview
• Short-term SiP Dynamics By Market Segment: Shipments
• Short-term SiP Dynamics By Market Segment: Revenue
• SiP Production By Supplier
• SiP Supplier Market Shares And Forecast: Revenue
• SiP Application Mix

Supplier Details

• TSMC
• UMC
• Intel
• Sony (Stacked CIS)
• Samsung Electronics
• Texas Instruments
• Micron
• SK hynix
• YMTC
• ASE (w/Usi and w/SPIL)
• JCET
• Amkor
• PTI
• TFME
• Nepes
• China WLCSP
• TianShui Huatian

Conclusions

Yole Group Corporate Presentation

Advanced Micro Devices (AMD), Amkor Technology, Apple, ASE, Authentec, Broadcom, China Resources Microelectronics, China WLCSP, Chipbond, Chipmore Technology, ChipMOS, Deca Technologies, ECHINT, Forehope Electronic, Foxconn, GlobalFoundries, Global Unichip Corp (GUC), Google, Hitech Semiconductor, Hon Hai, IBM, Inari Berhad, Infineon, Intel, JCET, JSI, King Yuan Electronics, Lockheed Martin, MediaTek, Micron, Murata, Nepes, Northrop Grumman, NVIDIA, Payton Technologies, Powertech Technology, Qorvo, Qualcomm, Samsung Electronics, Samsung Electro-Mechanics, SJ Semiconductor (Jiangyin) Corp., SK Hynix, Skyworks, SPIL, Sony, ST Microelectronics, Taiyo Yuden, Texas Instruments, TianShui Huatian, Tongfu Microelectronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Unimos Microelectronics, United Microelectronics Corporation, Universal Scientific Industrial (USI), UTAC, Wisol, Yangtze Memory Technologies Corp, Yibu Semiconductor, Zhejiang Chuanghao Semiconductor, and more.

Key Features

• Direct access to the analyst providing opportunity for Q&A
• Packaging industry dynamics highlights and analyst viewpoint
• Quarterly data update on key advanced package types: FCCSP, FCBGA, WLCSP/Fan-In, Fan-Out packages, 3D-stacked packages, and SiP
• Market forecast through 2028, in $US, units and wafers
• Average Selling Price (ASP) analysis
• End-product/device application mix
• Supplier market shares for TSMC, Intel Samsung Electronics, Amkor, JCET, ASE w/SPIL, PTI, Nepes, SPIL, Huatian, TFME, SK Hynix and Sony
• Advanced Packaging Capex​

What's new

• 2023 Capex forecast update
• End-system volumes have been updated for all modules
• New investments and technology announcements

Product objectives

To study: 

• The Fan-Out, WLCSP/Fan-In, 3D Stacked, FCBGA, FCCSP and SiP markets.
• Near-term market dynamics on a quarterly basis.
• Capex per major player.
• Market shares of leading OSATs, foundries and IDMs.
• Package ASP per given market and platform.​

Available on our Yole Group All-Inclusive Packaging Package

After a weak first half of the year, Advanced Packaging revenues are expected to recover 23.8% in Q3 2023

While demand is remaining soft for several end-markets, inventory digestion is taking longer than expected and package manufacturers have seen their utilization rates decline throughout the first half of 2023. In Q2 2023 revenues increased 8.3% compared to the previous quarter. In the second half of the year, signs of recovery start to be seen and in Q3 2023 results are expected to improve with strong sequential growth of ~23.8%, showing a ramp in manufacturing.

2023 will be a weaker year for the semiconductor industry and the AP market is expected to remain flat at $43.9B. AP market revenues are expected to show a slight grow for 2.5D/3D, FCBGA and FO packaging, whereas for the other platforms, revenues should decrease mainly due to the weak demand in mobile and consumer market. In 2024 we expect the AP market to start recovering at a stronger pace with 12.4% growth. This growth will be driven by the AI hype generated by the surge of generative AI applications such as ChatGPT, as its adoption is needed for devices such as CPUs, GPUs, FPGAs and HBM.

Advanced packaging surpasses the overall semiconductor market growth, reaching $43.9B in 2022

Advanced packaging (AP) revenue is expected to grow at an 8.7% CAGR, from $43.9B in 2022 to $72.4B by 2028. AP revenues have grown 9.9% in 2022 compared to the previous year, surpassing the semiconductor market growth rate, which achieved 2%. In terms of package units, AP market was flat due to soft demand in the mobile & consumer market. Reasons behind AP market growth include the adoption of more advanced and complex packages with high ASPs. AP is driven by megatrends like AI, HPC, automotive electrification and 5G adoption.

Flip-chip BGA, flip-chip CSP and 2.5D/3D are the dominating packaging platforms in terms of revenues, with 2.5D/3D technologies showing the highest growth rate, as it is expected to grow from $8.9B in 2022 to $23.2B in 2028 with a 17.2% CAGR. Advanced packaging units are expected to show a 4.1% CAGR2022-2028, with WLCSP, SiP and FCCSP leading in terms of the total number of units.

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