2.5/3D Packaging Comparison 2025

Key Features

• Comparison of:
  • Processors using advanced technology node.
  • Innovative Packaging technologies.
  • TSMC’s CoWoS-S, InFO-oS, InFO-L (UltraFusion) technology to other advanced packaging.
• Physical analysis of the processor dies, and the memory dies integrated in the different packages
• The packaging assembly process is described for each technology employed in the different components.
• Cost analysis of each component.

What's new

• NVDIA H100
• Apple M2 Ultra
• AMD RADEON RX 7900 XTX

Product's objectives

• Provide a detailed comparison of physical and manufacturing costs between NVIDIA H100, AMD Radeon RX 7900 XTX, and APPLE M2 ULTRA.
• Provide a comprehensive analysis using optical and scanning electron microscopy (SEM) cross-sections to reveal chip integration and placement, identifying the packaging technology utilized.
• Provide insights into back-end construction analysis to uncover the packaging structure of each product.
• Provide coherent tomography (CT) 3D X-ray scans to visualize the layout of chips in the different packages analyzed.
• Provide a cost analysis comparison to identify the various cost factors in each assembly process and determine the complete component cost.
  

2.5D & 3D packaging solutions became critical and its market will exceed $28B by 2029

Advanced packaging with its 2.5D and 3D solutions has become critical for enhancing device performance and bandwidth. The implementation of high-end system units has significantly increased across high-performance computing, networking, artificial intelligence, autonomous driving, personal computing, and gaming. The 2.5D and 3D packaging market revenue is projected to grow at a 37% CAGR, from $4.3 billion in 2023 to over $28 billion in 2029, with telecom and infrastructure, as well as mobile and consumer applications, holding the largest market shares.

The slowdown in scaling methods, coupled with diversifying demands for high performance and smaller footprint packages, has driven designers to adopt advanced packaging solutions to meet these performance requirements. As a result, 2.5D and 3D packaging solutions are becoming increasingly complex, with more players entering the market to enhance product performance. The growing demand for ultra-high routing and enhanced performance has been addressed through heterogeneous integration, further driving the adoption of 2.5D and 3D packaging technologies.

This report examines various components employing 2.5D and 3D packaging structures:

• NVIDIA H100 utilizes a 2.5D CoWoS platform, stacking the 80GB HBM2E memory and GPU die on a silicon interposer.
• AMD Radeon RX 7900 XTX features chiplet integration, with the processor and MCDs connected by an extreme bandwidth Infinity Fabric Fanout interconnect, enabling 5.3 TB/s bandwidth between the processor and MCDs.
• Apple M2 Ultra employs UltraFusion technology, realized through a chip-first/RDL-last process flow. This indicates that the Apple M2 Ultra uses TSMC InFO-L technology, allowing two processor dies to communicate via a silicon bridge (LSI).

The report provides multiple analyses focusing primarily on different advanced packaging solutions. It also includes a brief analysis of the processor dies and memory dies integrated within the various packages. Additionally, comprehensive optical and scanning electron microscopy (SEM) cross-section analyses reveal chip integration and placement within the package, which determine the packaging technology employed. Back-end construction analyses further detail the packaging structure. Coherent tomography (CT) 3D X-ray scans are presented to showcase the chip layout in the analyzed packages. Each technology's packaging assembly process is described in detail, and the report also includes a cost analysis for each component. Finally, a cost comparison is provided to identify the various cost factors in each assembly process and the overall component costs.

Overview/ Introduction 

• Executive Summary
• Reverse Costing Methodology
• Glossary

Company Profile & Supply Chain

• Company Financials
• Packaging Technologies
• Market Analysis

Teardown Analysis 

• Summary
• Physical Analysis ( NVIDIA H100, AMD Radeon RX 7900 XTX, APPLE M2 ULTRA)
• Board Teardown
• Package Analysis
• Package Dimensions & Overview
• Package Opening
• Package X-Ray Images
• Package Cross Section
• Dies Analysis 

Manufacturing Process 

• Summary ( NVIDIA H100, AMD MI210, APPLE M1 ULTRA, AMD RYZEN 7 5800x V-CACHE)
• Front End Manufacturing process
• Fab Unit
• Package Assembly
• Package Assembly Process Flow

Cost Analysis 

• Summary
• Yields (NVIDIA H100, AMD Radeon RX 7900 XTX, APPLE M2 ULTRA)
• Dies Cost
• Package Assembly Cost
• Complete Component Cost

Estimated Manufacturer Price Analysis

• Estimation of the Manufacturer Price

Feedbacks 

Related Report 

About Yole Group 

Nvidia, AMD, Apple, TSMC