Market and Technology Trends
3D Imaging & Sensing 2023
By Yole Intelligence —
13% growth in 3D sensing from intensified technological developments to a doubled market value of $17.2B by 2028, countering the slowing mobile market.
YINTR23329
AAC Technologies, Abax sensing, ADAPS PHOTONICS, Addison care, Aeva, Aeye, AGC, Agent Factory, Airy3D, Alipay, Allegro, Alpsentek, Altera, amazon robotics, Ambarella, ams-OSRAM, Analog Devices, Analog Photonics, Ansys, Apple, Applied Materials, Aptiv, Arcsoft, ARM, Artilux, asc3D, ASE Technology Holding, ASML, Audi, aurora, Aurora flight sciences, Autoliv, AutoX, Baraja, Basler, Baumer, BEA, Beamagine, Benewake, Blickfeld, BMW, Bosch, Brookman Technology, Buick, Cadillac, Canon, Carl Zeiss Meditec, CCS, cellid, Century Arks, Cirrus Logic, Cloudlight, Cognex, Coherent, Computar, Continental, Coresix, Corning, Cruise, Cubert, D3 Engineering, Dahua, Daifuku, DARPA, Dell, Deptrum, Desay SV, Dessmann, DIGANTARA, DJI, Domi, Draper, Dyson, DZO, ecovacs, Elock Security, Emberion, Emotion3D, Epistar, Epticore Microelectronics, espros photonics corporation, evolv, Excelitas, EyeSight, EZVIZ, Faro, First Sensor, Fortsense, Foxconn, Fujinon, GalaxyCore, gco, Geely, General Electric, Genesis, Gesture Tek, Ghopto, Google, Gpixel, GreenValley International, GSEO, GZDL, Hamamatsu, Haylion, Hesai, Hexagon, Hikrobot, Himax, Hisilicon, Hitachi Astemo, HJI Technology Co., Honda, Honeywell, Honor, HTC, Huatian, Huawei, Human Horizons, Hyundai mobis, IBM, Imago, IMI, imou, Infineon, Inivation, Innoviz, Innovusion, Intel, Inuchip, Inuitive, iRAYPLE, iRobot, ISORG, Jabil, Jinghong, Joint Micro, JSR, Jungheinrich, Kaadas, Kantatsu, Ketek, Keyence, KION Group, Konecranes, Kowa, kudan, Kyec, Kyocera, Lam Research, Land Rover, Largan, Laser components, Lasertel, Lavna, Leia, Leica Geosystems, Lenovo, Leopard, Lexus, LG, LG Innotek, Linx, Lips, LMI Technologies, Loginext, Lucid Vision Labs, Lumentum, Lumotive, Luxvisions, LX Semicon, Magic Leap, Magna, Mando, Mantis Vision, Mazda, Meizu, Melexis, Mercedes-Benz, Meta, Metalenz, Microsoft, Moritex, Motorola, Mouser Electronics, Moxtek, MPD, Myntai, Nanos, Navitar, neato robotics, NeoPhotonics, Nextcore, Niametris, Nikon, Nissan, NXP, Occipital, Ocuvera, Ofilm, OMNIVISION, Omron, onsemi, Opnous, Oppo, OPT Machin Vision, Optovue, Orbbec, Ours, Ouster, Owl AI, Pamtek, Panasonic, Planopsim, Parrot, Peugeot, Philips, photonicSENS, pmd, Pomeas, Prophesee, Qtech, Qualcomm, Quanergy, Qurv, Raytheon Technologies, Redway 3D, Refly, Rgo Robotics, Ricoh, Riegl, roborock, Robosense, Rogbid, Routescene, RPC Photonics, Saccade Vision, Samsung, Scantinel Photonics, SCD, Schneider, Schott, Seedland, Sensata Technologies, Sense time, Sevensense, Sharp, SICK, Siemens Healthineers, Silicon Integrated, SK hynix, Slamcore, Smarter Eye, SmartSens, Soitec, Sony, SpaceX, Speedcargo, Steam, SteerLight, Stereo Labs, STMicroelectronics, Sunex, Sunny Optical Technology, Süss MicroOptics, SWIR Vision Systems, Tamron, Tango, TCL, Teledyne Dalsa, Teledyne E2V, Tempo, Terabee, Tesla, Texas Instrument, TKH Group, Tokyo Electron, Tong Hsing Electronics Industries, Topcon, Toppan, Toshiba, Tower Semiconductor, Toyota, Traptic, TriEye, Trimble, TrinamiX, Trioptics, Truly, Trumpf, TSMC, Tunoptix, tuya, Ultraleap, Valeo, Valve, Varjo, Velodyne, Vertilite, Viavi Solutions, VisionICs, Vomma, VoxelSensors, Vzsense, Wabco, Waymo, Win semiconductors, WLCSP, wordop, Xiaomi, XILINX, Xvisio, Yitu, Zeon, ZF, Zhejiang Crystal-Optech Co., Zoller-Fröhlich, Zong Mu, ZPMC, ZTE, and more.
Key Features
- 2018-2028 forecast for 3D imaging and sensing markets (Munits, $M)
- 2018-2028 forecast for module level (camera module) and semiconductor level (VCSEL, emitter, sensor, lens sets) for 3D imaging and sensing markets
- Application trends for all end-markets
- Overview of the 3D imaging and sensing supply chain, including sensor manufacturers, VCSEL manufacturers, optics manufacturers (filter, DOE, WLO, lens sets), assembly and test houses, camera module manufacturers, and OEMs products and technology Comparison of different 3D imaging& sensing technologies and future associated technology trends.
What's new
- 2018-2028 forecasts for 3D imaging and sensing
- In-depth applications and end-market analyses
- Disruptive technologies analysis (metasurfaces, wafer-level optics, SWIR, event…)
Product objectives
- To furnish readers with a market-dynamics-based scenario for cameras within the 3D-sensing market, providing an understanding of the impact of 3D-sensing technology on the semiconductor industry:
- Hardware revenue forecasts, shipment volume forecasts, ASP forecasts
- Technical market segmentation
- Application range
- To offer key technical insights and analyses into market trends:
- Key application use-cases
- Market and technology dynamics
- Emerging markets and roadmaps
- To deliver an in-depth understanding of the company ecosystem:
- Who are the players? What are their relationships inside this ecosystem?
- Which are the key suppliers to watch, and what technologies do they provide?
3D sensing market set to more than double revenue by 2028, reaching $17.2B
The 3D imaging and sensing market generated $8.2B in revenue in 2022. 409 million units were shipped, the majority of which were for the Mobile and Consumer markets. However, limited recent design wins have led to a downward revision of revenue growth in this segment. ToF technology is increasing its market share, while structured light is expected to decline. The action in 3D sensing is moving from mobile to more market diversification with automotive and industrial applications. Smart home applications, including drones, XR headsets, vacuum cleaner robots, smart door locks, and home appliances, will double their share of the market by volume, while the Automotive market will experience impressive growth in ADAS LiDAR and in-cabin sensing, pushed by the trend for autonomous and new-energy vehicles. By 2028, the total 3D imaging and sensing market is expected to more than double to $17.2B.
88% of the consumer 3D camera module market held by the top 9 companies
The TOP 9 companies in the Mobile and Consumer 3D camera module market generated 88% of the overall revenue. The Mobile & Computing 3D sensing market is a stronghold for historical leaders, such as STMicroelectronics and Sony in sensors, with Pmd and Ams as challengers, Coherent and Lumentum in VCSELs, LG Innotek in camera module manufacturing, etc. Consequently, some leading 3D sensing companies focus on non-mobile consumer applications, such as XR, drones, smart door locks, wearables, consumer robotics, etc. This leaves room for new entrants with potential new technologies; they should target the non-mobile and non-computing markets to be most effective. In 3D sensing, STMicroelectronics’ global strategy is confirmed, whereby it addresses the mass markets with relatively lower ASP with target cumulative volumes from hundreds of millions to billions of units. In contrast, Sony continues to deliver high-resolution and higher price products.
Intense technological research and development to unlock new opportunities
3D imaging and sensing is supported by a strong technological push and intense R&D effort at the sensor, emitter, optics, and module levels. The race for a smaller pixel is expected to unlock new market opportunities and increase penetration of these technologies. One of the most desired capabilities for manufacturing is in-pixel hybrid stacking. Industrial and automotive LiDAR applications concentrate around 940nm and 1550nm, now moving slowly from NIR to the SWIR region, and LiDAR FMCW should emerge by 2027. Metasurfaces are the ultimate evolution of flat optics to decrease the cost and size of camera modules and bring new functionalities. Event-based imaging is also exploring 3D sensing for industrial inspection and XR tracking applications. SWIR sensing should bring higher 3D sensing performance, and quantum dots sensors should emerge commercially in the coming years. Single-camera 3D technology is competing with short-distance stereo at a lower cost, thanks to the specific design of the optics.
Glossary
Table of contents
Report objectives
Scope of the report
Methodology
About the authors
Companies cited in this report
What we got right, what we got wrong
Three-page summary
Executive summary
Context
Market forecasts
Market trends
- Mobile and Consumer
- Mobile
- Computing
- Smart IoT
- Automotive
- Medical
- Industrial
- Defense and Aerospace
- Conclusion
Industry and supply chain
- Mobile and Consumer
- Industrial and Automotive
- Focus on China
- Noteworthy news & M&As
- Conclusion
Technology trends
- Sensor pixel technology trends
- Focus on LiDARs and ToF technologies
- From wafer-level optics to meta-optics
- SLAM approach & passive 3D sensing technologies
- Event-based sensing
- SWIR technologies
- Conclusion
Conclusion and outlook
Yole Group related products
Yole Group corporate presentation