Technology, Process and Cost Comparison
Ambient Light Sensor Comparison 2026
A closer look at the ambient light sensors adopted by leading consumer OEMs, highlighting design choices from players such as ams OSRAM and STMicroelectronics.
SPR26003SCOPE
Analyzed devices:
- ams OSRAM TCS34103
- ams OSRAM TCS3448
- ams OSRAM 50872
- iPhone 16 Pro ALS
- STMicroelectronics VD6287B0
PHYSICAL ANALYSIS
Physical analysis of five Ambient light Sensors featuring different package types:
- OLGA Package
- ams OSRAM TCS34103
- ams OSRAM TCS3448
- iPhone 16 Pro ALS
- STMicroelectronics VD6287B0
- WL Package
- ams OSRAM 50872
Technology :
- Light sensing
- WLP & OLGA Package
- MIM capacitors
- Photodiodes
- TSV
Type of Analysis:
- Optical View
- SEM View
- Cross section
- EDX
- Delayering
MANUFACTURING PROCESS FLOW
We describe the supply chain for each sensor, including the front-end and back-end parameters and the fab locations.
Technical analysis:
- Device
- Process
- Wafer
- Material
COST ANALYSIS
Cost analysis of each sensor, including a detailed front-end and back-end cost breakdown for each component.
Type of Analysis:
- Yields
- Front End Cost
- Die Cost
- Back End
- Component cost
Report's objectives:
-
Physical Analysis and cost Estimation of the different Ambient light Sensors to highlight the technological and economic positioning strategies of leading market players.
-
Analyze and compare the architectures, technologies, and manufacturing processes of five ambient light sensors (ALS) from ams OSRAM and STMicroelectronics integrated into smartphones and wearable devices.
- Provide a detailed physical and technological characterization of the sensor packages and dies using optical/electron microscopy, deprocessing, cross-sectional analysis, and EDS techniques.
- Evaluate the supply chain and manufacturing costs of each sensor by detailing fabrication steps, materials used, and bill-of-materials (BOM) costs.
- Estimate the total manufacturing cost and selling price of the different ALS devices to highlight the technological and economic positioning strategies of leading market players.
The ambient light sensor is a device that measures the intensity and characteristics of the surrounding light environment. It helps electronic devices adjust their display brightness. These sensors are integrated in Smartphones or Wearable. To illustrate, and according to Yole Group's Sensors and Actuators for Wearables 2025 report, ambient light sensor revenue totaled $21 million in 2024 and is expected to reach $55 million in 2029, representing a 10% CAGR.
This comparative report synthesizes the results of detailed physical, technical, supply chain, and costing analyses of a selection of five ambient light sensors from ams OSRAM and STMicroelectronics extracted from Phones and Watch’s.
The ams OSRAM TCS3448, packaged in a 6 mm² OLGA 6-pin format, is used in Chinese flagship smartphones such as the Vivo X300 Pro and Xiaomi 17 Ultra. The ams OSRAM 50872, packaged in a compact 3.6 mm² WLP, is found in more than eight Apple Watch series. The STMicroelectronics VD6287B0, with its larger 18.4 mm² package, is used in more than 10 Apple iPhone models, including the iPhone 16 and iPhone 17e. Finally, an unidentified ams OSRAM sensor, measuring 10.5 mm², is integrated into the latest iPhones, including the iPhone Air, iPhone 17, iPhone 17 Pro, and iPhone 17 Pro Max.
In this report, we present a detailed physical analysis of each sensor package and Die using optical and electron microscopy, deprocessing, cross-sectional analysis, and energy-dispersive X-ray spectroscopy (EDS) to identify the underlying technologies and manufacturing processes. We then calculate the cost of each manufacturing step and provide itemized fabrication and bill-of-materials costs. Finally, we use these data to estimate the total cost and selling price.
Overview / Methodology
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile, Supply Chain & Market
- ams OSRAM, STMicroelectronics
- Market Forecasts
- Supply Chain
Physical Analysis
- Exhaustive Results of Physical Analyses
- ams OSRAM TCS34103
- Specs from OEM
- Package Analysis
- Die Analysis
- Delayering & Main Blocks
- ams OSRAM TCS3448
- Specs from OEM
- Package Analysis
- Die Analysis
- Delayering & Main Blocks
- ams OSRAM 50872
- Package Analysis
- Die Analysis
- Delayering & Main Blocks
- iPhone 16 Pro Light Sensor
- Package Analysis
- Die Analysis
- Delayering & Main Blocks
- STMicroelectronics VD6287B0
- Package Analysis
- Die Analysis
- Delayering & Main Blocks
Physical Comparison
- Exhaustive Results of Physical Analyses
- Package Comparison
- Die Comparison
Manufacturing Process Flow
- Supply Chain
- ASIC Circuit Front-End Fabrication Unit
- Optical Filters & Back-End
Cost Analysis
- Yields Synthesis
- Exhaustive Results of Physical Analyses
- Wafer Front-End Costs
- Optical Filter & Passivation Costs
- Die Costs
- Packaging Costs
- Component Costs
Selling Price Analysis
- Manufacturer Price Comparison
Related Products
Apple, Oppo, Vivo, Xiaomi, ams OSRAM, STMicroelectronics, TSMC, OSAT and more
