Technology, Process and Cost
AMD - Ryzen™ 9 9950X3D CPU with 3D V-Cache™ V2
Next-gen Ryzen 9 architecture combining advanced nodes, chiplets, and 3D V-Cache V2 from AMD stacking for optimized performance and cost.
SPR26037PHYSICAL ANALYSIS
- Detailed photos in optical and SEM views
- Precise thickness measurements
- Analysis of 3D V-Cache™ V2
- Package opening
- Die delayering
- Material identification
Technology
- TSMC advanced node
- 3D V-Cache™ V2
Type of Analysis
- SEM View
- TEM View
- Floorplan
- Cross section
- Delayering
- Optical View
- X-ray View
MANUFACTURING PROCESS FLOW
- Recreation of manufacturing process flow
- Step by step process flow
Technical analysis
- Module
- Component
- Process
- Wafer
- Material
- IP
- Packaging
COST ANALYSIS
- Supply chain evaluation
- Simulation of device cost and advanced packaging cost
Type of Analysis
- Die cost
- Yields
- Package assemble cost
- Raw wafer cost
- Wafer Front-End cost
- Die cost
- Dicing & Probe test cost
- Package assemble cost
- Final test cost
In recent years, high-performance desktop processors have increasingly relied on advanced packaging technologies to overcome scaling limitations and improve performance, power efficiency, and integration density. In this context, 3D integration and chiplet-based architectures have become key enablers for next-generation CPUs.
This report presents a comprehensive analysis of AMD’s Ryzen 9 processor with advanced technology node featuring new 3D V-Cache V2 technology. It synthesizes the results of detailed physical, technical, supply chain, and cost analyses of the device, including its chiplet architecture, compute dies, I/O die, and stacked SRAM cache.
We provide a complete manufacturing and costing analysis of the processor, covering front-end semiconductor technologies, advanced packaging using TSMC’s SoIC hybrid bonding, and overall system integration. The report also delivers a full cost breakdown and supply chain overview, offering insights into the technological and economic drivers behind AMD’s latest high-performance CPU platform.
Overview / Introduction
- Executive Summary
- Specifications
- Reverse Costing Methodology
- Glossary
Company Profile & Supply Chain
- AMD Financials
- AMD Products
- AMD V-Cache
Teardown Analysis
- Summary
- AMD Ryzen 9 Processor Package
- Package Assembly
- Views & Dimensions, X-Ray Analysis
- Cross Section
- Opening
- I/O Die, CPU Die, Cache Die
- Views & Dimensions
- Delayering & Process
- Die Cross Section
Manufacturing Process Flow
- I/O Die Front End & Fab Unit
- CPU Die Front End & Fab Unit
- Cache Die Front End & Fab Unit
- Carrier silicon
- Hybrid bonding
- Final Test & Assembly
Cost Analysis
- Cost Analysis Summary
- Yields & Explanations
- I/O Die Cost
- CPU Die Cost
- Cache Die Cost
- Hybrid bonding Cost
- Package Assembly
- Component Cost
Estimated Manufacturer Price Analysis
- Estimation of the Manufacturer Price
Feedbacks
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TSMC, AMD