AMD Instinct MI210 GPU with HBM2e

Overview/ Introduction 

• Executive Summary
• Datasheet
• Reverse Costing Methodology
• Glossary

Company Profile & Supply Chain 

• AMD Financials
• AMD Products
• AMD Instinct MI210
• Market Revenue

Teardown Analysis 

• Summary
• AMD Instinct MI210 Accelerator
• Package Dimensions & Overview
• Package Opening
• Package X-Ray Images
• Package Cross Section 
• HBM Analysis
• GPU Analysis
• Bridge Die (Embedded bridge fan out)

Manufacturing Process 

1. Summary
2. HBM Stack Manufacturing process (Logic &DRAM) & Fab Unit
3. GPU Manufacturing process & Fab Unit
4. Bridge Die
5. Package Assembly - Embedded Bridge Fan Out Process
6. Package Assembly - Die stacking on mold interposer

Cost Analysis 

• HBM Logic Wafer Cost
• HBM DRAM Cost
• HBM Stack Cost
• Bridge Die Cost
• Mold Interposer - Embedded Bridge Fan Out Assembly
• Assembly Dies on Mold Interposer Cost
• Component Cost

Estimated Manufacturer Price Analysis  

• Estimation of the Manufacturer Price

Feedbacks 

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Graphics Processing Unit (GPU) market revenue increased by 53% in 2021 compared to 2020, reaching $23 billion. AMD and NVIDIA are the two main players in the GPU market. Growth for artificial intelligence acceleration in server applications is driving the GPU market.

AMD introduced the Instinct MI210 PCle accelerator card targeting datacenter, server, and workstation applications. The Instinct MI210 accelerator is powered by AMD’s second generation CDNA architecture with outstanding performance. AMD claims that the performance of this accelerator is twice that of its competitor. The GPU architecture is designed for mainstream high-performance computing and artificial intelligence. The component features a large silicon chip processor using TSMC’s 6nm lithography FinFET process. The component hosts 64GB dedicated memory capacity that is integrated using four High Bandwidth Memory (HBM2e) components. HBM2e delivers fast data transfer while using less power.  It includes several stacked Dynamic Random Access Memory (DRAM) dies of 16Gb with through silicon via technology, which enables memory routing and high data transfer rates.

The Instinct MI210 integrates more than 4,000mm² of silicon in a single package. The complex package features an elevated fan-out silicon bridge needed for high density interconnection between the processor die and the memory. The ultra-thin silicon bridge chip is embedded within molding material forming a molding interposer. Development of a molding interposer with several embedded bridge dies overcomes critical silicon interposer drawbacks like parasitic resistance and the high cost of the silicon interposer manufacturing process.

To reveal all the details of the AMD Instinct MI210 GPU, this report features multiple analyses. One is a front-end construction analysis to study the key features of the chiplet integration, TSMC’s 6nm lithography processor and HBM2e. A back-end construction analysis reveals the packaging structure. Moreover, this report includes a detailed study of the die cross-sections. In addition to a complete analysis by using Scanning Electron Microscopy (SEM) cross-sections, material analyses, and delayering, we show Coherent Tomography (CT) 3D X-ray scans to reveal the layout of the chips in the package. Furthermore, the report includes a description of the assembly process. Lastly, this report furnishes a complete cost analysis and a selling price estimation of AMD’s Instinct MI210 processor.

• Advanced Micro Devices
• Taiwan Semiconductor Manufacturing Company
• SK hynix

Key Features

• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Cost analysis

What's new

• New packaging solution using an embedded bridge
• Organic interposer used instead of a silicon interposer
• HBM2e with higher performance
• GPU using TSMC 6nm lithographic process
• Integration of over 4,000mm² of silicon