Technology, Process and Cost

AMD Instinct MI210 GPU with HBM2e

By Yole SystemPlus

AMD’s processor integrating heterogeneous 3D stacked HBM2e DRAM and elevated fan-out bridge (EFB) for high performance packaging

Key Features

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Cost analysis

What's new

  • New packaging solution using an embedded bridge
  • Organic interposer used instead of a silicon interposer
  • HBM2e with higher performance
  • GPU using TSMC 6nm lithographic process
  • Integration of over 4,000mm² of silicon 


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