Technology, Process and Cost
Apple - Modem - C1 - From iPhone 16E
Analysis of Apple’s first in-house C1 RF modem (iPhone 16E), focusing on technology and cost, comparing with Qualcomm SDX71M (iPhone 16 Pro Max) and Samsung’s S5400 (Google Pixel 9Pro).
SPR25949
Key Features
- Detailed Floorplan
- Detailed photos
- Precise measurements
- Die analysis
- Package analysis
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Physical Comparisons
- Technical Comparisons
- Cost Comparisons
What's new
Full analysis of Apple C1 Modem in iPhone 16E as well as comparison with Qualcomm SDX71M & Samsung Exynos S5400.
Product objectives
This Technology & Cost report reveals Apple’s first in-house C1 RF modem in the iPhone 16E, highlighting its design, technology choices and cost. It then compares Apple’s C1 with Qualcomm’s SDX71M (in the iPhone 16 Pro Max) and Samsung’s Exynos S5400 (in the Google Pixel 9Pro), showing how each modem differs in both technology and price.
Almost overshadowed by the iPhone 16E launch, Apple quietly dropped a major revelation: it has begun producing its own modem – C1. In 2019 Apple purchased the majority of Intel’s smartphone modem business, including patents and key engineering staff. This signaled Apple’s serious commitment to building an in-house modem.
Qualcomm initiated the 5G wave with its device for high-end smartphones, projecting significant revenue growth. An RF Front-End Market Forecast expects the 5G market is expected to be stable in the next few years. In this context, Yole Group sees this as an ideal opportunity to assess the new technology developed by Apple internally.
In this Technology & Cost report, we offer insights into the technological advancements and cost structure of the RF modem featured in Apple’s latest smartphone, the iPhone 16E. A key highlight of the study is the complexity of these modem technologies, which utilize FinFET transistors with a large number of metal layers. The report includes a thorough analysis of the chipset, with in-depth technological assessments, alongside cost analyses and price estimates.
It also traces the progression of RF modems and evaluates solutions at the chipset, technology, manufacturing process, and cost levels. Finally, the report compares Apple’s C1 modem with two other major solutions — Qualcomm’s SDX71M (from iPhone 16 Pro Max) and Samsung’s Exynos S5400 (from Google Pixel 9 Pro) — focusing on both technological and price aspects.
Overview
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profiles
Physical Analysis
- Package Assembly
- Views & Dim.
- Opening
- Cross-Section
- IC Die
- Views & Dim.
- IR Microscopy
- Delayering
- Floorplan
- IR Microscopy
- Delayering details
- Die Cross-section
- Process Characteristics
- DRAM Die
- Views & Dim.
- Die Cross-section
Physical Comparison
- Modules & Functionality
- Packages
- IC Dies
Manufacturing Process Flow Analysis
- Global Overview
- Front-End Process
- Wafer Fabrication Unit
- Packaging
Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation & Hypotheses
- Front-End
- Back-End
- IC Die
- Packaging
- Component Cost
Selling Price
Feedbacks
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