Technology, Process and Cost
APU – Apple – A18 Pro SoC in iPhone 16 Pro Max
Detailed physical data, processor architecture analysis and cost structure of Apple’s most advanced smartphone chip.
SPR25891
Key Features
- Detailed optical and SEM photos
- Precise measurements
- Die analysis
- Package analysis
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Physical Comparisons
- Floorplan Comparisons
- Cost Comparisons
What's new
- The most advanced Apple A series processor
- Consumer product using TSMC N3E
- Comparison with A17 Pro
Product's objectives
- Close look on the most advanced smartphone processor technology
- Understanding of advanced processor technology used by the main players
- Comprehensive physical technology and detailed data of chip packaging, processor dies and IPD capacitors
- Clear view on processor architecture focusing on compute unit, e.g. CPU, GPU, NPU and SRAM cache
- Understanding the IP design with detailed core dimension measurement
- Knowledge of Apple A series processor evolution by comparing with the previous version A17 Pro
- Overview of smartphone processor supply chain
- Provide the insight of economic factors in this market with the cost comparison
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Apple A18 Pro Chip.
Apple's A18 Pro SoC stands as a landmark in the evolution of its flagship silicon, showcasing unparalleled advancements in semiconductor engineering through the integration of state-of-the-art packaging technologies and groundbreaking processing capabilities. This report provides an in-depth examination of the SoC's physical structures, enriched by precise dimension measurements and high-resolution imaging from optical microscopy (OM), scanning electron microscopy (SEM), computed tomography (CT) scans of the packaging, and transmission electron microscopy (TEM) analysis of TSMC’s 3nm N3B process technology. A detailed physical comparison between the A17 Pro and A18 Pro highlights advancements in design, including differences in die size, transistor density, and integration of components. The A18 Pro is confirmed to be manufactured using TSMC’s 3nm N3E process technology, reflecting a shift from the N3B used in prior designs, offering improvements in performance-per-watt and yield optimization. The study delves into the advanced packaging design, processor die, DRAM modules, and integrated passive devices (IPD) dies, revealing intricate structural details. Key intellectual property (IP) configurations for the CPU, GPU, neural engine, and cache memory are explored, emphasizing Apple’s innovative strategies for performance and energy efficiency.
Furthermore, the TEM analysis offers a granular view of TSMC’s N3B node, showcasing its structural and material innovations. The report concludes with a comprehensive cost structure breakdown, encompassing material costs, manufacturing processes, and assembly expenditures, providing a thorough understanding of the technological sophistication and economic factors driving this high-performance system-on-chip.
Overview / Introduction
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Company Profile
- Company Profile
- Apple Products
- Market Analysis
Physical Analysis
- Smartphone Teardown
- Packaging
- DRAM
- Processor
- IPD
- 3 nm FinFET FEOL (TEM)
- Processor Floorplan
Physical Comparison
Manufacturing Process Flow Analysis
- Global View
- Processor Die Process
- Processor Die Fab unit
- InFO Packaging Process
- Final Test
Cost Analysis
- Summary & Supply Chain
- Yields Explanation & Hypotheses
- Front-End Wafer Cost
- Die Cost
- Packaging Cost
- Component Cost
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