Technology, Process and Cost Comparison
Automotive Navigation Inertial Sensor Comparison 2022
By Yole SystemPlus —
Detailed technology and cost comparison of 11 MEMS inertial sensors from Bosch, STMicroelectronics, TDK-Invensense, Epson, and Senodia Technologies
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
Company Profile & Supply Chain
- Market Overview
- Company Profile
- Supply Chain Overview
- Senodia Technologies
- Package Analysis
- Supply Chain Summary
- Sensor Overview : Package, ASIC, MEMS
- Package Cross-Section
- MEMS die design and Cross-section
- Technology evolution and Physical comparisons per manufacturer
- Senodia Technologies
- Yields Explanations & Hypothesis
- MEMS FE Cost Comparison
- MEMS Die area vs Die Cost Comparison
- Component Cost Comparison
Yole Group corporate presentation
Key Features :
- Detailed photos
- Precise measurements
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Technology and Cost Comparison for the MEMS inertial sensor suppliers
- First report from Yole SystemPlus on this subject.
- Focus on MEMS navigation market.
- All the analyzed components are found on the manufacturers’ websites and are available on the market.
- First analysis of new market player, the Chinese company Senodia Technologies.
- MEMS Suppliers: BOSCH, EPSON, Senodia Technologies, STMicroelectronics, TDK-Invensense.
- MEMS Foundries: BOSCH, Seico Epson, STMicroelectronics, X-Fab, TSMC.
- Automotive module supplier: Hyundai.
Vehicle systems contain a substantial number of inertial MicroElectroMechanical Systems (MEMS) devices, and this number will continue to grow. Vehicle navigation systems have rapidly become standard in cars and are one of the main examples of automotive systems in which MEMS accelerometers and gyroscopes are widely used, individually or combined.
According to Yole Intelligence, the automotive navigation market for inertial sensors is expected to reach $365M by 2027, compared to $150M in 2021. The fast-growing demand for navigation assistance in cars is leading Inertial Measurement Units (IMUs) to be coupled with Global Positioning System (GPS) to precisely monitor the vehicle’s location in real time.
While Bosch is one of the main players in the market, Asian players are targeting the fast-growing Chinese automotive market. One example is Senodia Technologies, which is headquartered in China.
To encapsulate the increasing interest in the automotive navigation inertial sensors market, Yole SystemPlus provides a deep comparative review of technology, supply chain, and cost of 11 MEMS inertial sensors. The reference products come from the main suppliers in the market: Bosch, STMicroelectronics, TDK-InvenSense, Epson, and a new player in this domain, Senodia Technologies.
Yole SystemPlus has analyzed these inertial sensors to provide insights into their structure, technology, manufacturing processes, and production cost. We study the packaging, Application Specific Integrated Circuit (ASIC) dies, and MEMS dies, with detailed optical and Scanning Electron Microscope (SEM) pictures of the MEMS’ internal structures, package, and cross-section. We’ve also analyzed their substrate types and identified the MEMS manufacturing processes.
We note and compare technology evolutions for each manufacturer, including the differences between the main competitors. The MEMS inertial sensors are compared in terms of structures. We compare package substrate types, dimensions, and cross-section. For MEMS technology, we compare size, design, and sensing area. For ASIC technology we compare size and technology node.
Finally, we compare the MEMS inertial sensors’ costs in detail for the MEMS components, the ASICs as well as testing and packaging costs.
The report also includes a detailed study of the MEMS gyroscope supplied by Senodia Technologies and manufactured by XFAB foundry with its MEMS manufacturing process flow. The report also studies the MEMS Quartz T-structured gyroscopes supplied by Epson. Additionally, we provide an overview of ASIC and MEMS die design, size, and technology evolution for the main market players. We show how by decreasing the MEMS die area, the ratio between the sensing area and the die area increases.