Automotive Safety Inertial Sensors Comparison 2022

More and more vehicle systems are equipped with a large variety of MEMS inertial sensors to improve car reliability and driver safety. The application of MEMS inertial sensors in automotive systems is omnipresent. The advanced driver assistance systems (ADAS), the airbag safety system, and the electronic stability control (ECU) are the main examples of the automotive systems in which the MEMS gyroscope and accelerometer, or their combinations, are widely used.     

According to Yole Intelligence, the automotive safety market for inertial sensors is expected to reach $540M USD by 2027, compared to $360M USD in 2021. The fast-growing demand for safety and security in cars is one of the major factors in the growth of this market. BOSCH, Murata Analog Devices, and NXP are the main players.

To encapsulate the increasing interest in the automotive safety inertial sensors market, Yole SystemPlus provides a deep comparative review of technology, supply chain evaluation, and cost of 20 MEMS inertial sensors. The reference products come from the main suppliers on the market: BOSCH, Murata, Analog Devices, Panasonic, NXP Semiconductor, and a relatively new player in this domain – STMicroelectronics.

Yole SystemPlus has analyzed the technologies of these inertial sensors to provide insights on their structure, technology, manufacturing processes, and cost of manufacturing. We overview the packaging, ASIC dies, and MEMS dies, with detailed optical and SEM pictures of the MEMS internal structure, package, and cross-section. We’ve also analyzed their substrate types and identified their MEMS manufacturing process.

Comparison and technology evolutions for each manufacturer are noted, including the differences between the main competitors.

The MEMS inertial sensors are compared in terms of structure, package (substrate type, dimensions, cross-section), MEMS technology (size, design, sensing area), and ASIC technology (size, technology node).

Finally, the MEMS inertial sensors are compared in terms of cost: detailed MEMS cost, ASIC cost, test cost, and packaging cost.

This report includes the survey data and supply chain evaluation from our automotive teardown of the MEMS inertial sensors that are integrated by the main automotive module makers in the market. The most recent electronic components were selected for our analysis, and compared to the previous generations.

The supply chain for inertial sensors is evaluated for each supplier: MEMS designers, MEMS manufacturers, ASIC manufacturers, and MEMS suppliers. 

This report also includes a study of the latest gyro sensor supplied by Panasonic, in which the piezoelectric effect is used as a detection method. Also included is a study of the newest combo-sensors from Bosch.  Additionally, we provide a global overview of the evolution in ASIC and MEMS die design, size, and technology for the main market players, and we show how by increasing the MEMS die area, the ratio between the sensing area and die area increases.

• Suppliers: Analog Devices, BOSCH, DENSO, Epson, Murata, NXP Semiconductor, STMicroelectronics
• Foundry: Texas Instruments, TSMC
• Automotive Module Makers: Continental, TRW, DENSO

Overview / Introduction                                                                               

• Executive Summary
• Reverse Costing Methodology
• Glossary

Company Profile                                                                                            

• Company Profile & Supply Chain Overview
• Automotive Teardown Survey data

Physical Analysis                                                                                           

• BOSCH
• Murata Electronics
• STMicroelectronics
• Panasonic
• Analog Devices
• NXP Semiconductors
• DENSO
• EPSON
  • Component sourcing
  • Sensor Overview: Package, ASIC, MEMS
  • Package cross-section
  • MEMS Die design and Cross-section
  • Technology evolution and Physical comparisons per manufacturer

Technology Comparison                                                                                

MEMS Manufacturing Process                                                                     

• BOSCH
• Murata Electronics
• STMicroelectronics
• Panasonic
• Analog Devices
• NXP Semiconductor
• DENSO
• EPSON

Cost Analysis                                                                                                     

• Yield Explanations & Hypothesis
• BOSCH
• Murata Electronics
• STMicroelectronics
• Panasonic
• Analog Devices
• NXP Semiconductors

Conclusions                                                                                                      

Feedback                                                                                                          

Related Analyses      

About Yole Group

KEY FEATURES

• MEMS inertial sensors in automotive systems – analysis
• MEMS inertial sensors teardown – analysis
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated selling price
• Technology and cost comparisons for each MEMS inertial sensor supplier

WHAT'S NEW

• This report is focused on the automotive safety market.
• More than half of the analyzed devices are found in recent automotive systems supplied by BOSCH, Continental, etc.
• Supply chain evaluation is presented for the main automotive system manufacturers (BOSCH, Continental, TRW).
• Supply chain evaluation for ASIC dies and MEMS dies for each MEMS inertial sensor supplier.
• For all selected components, a further analysis is done:
• An analysis covering stand-alone accelerometers and gyroscopes, as well as combo sensors.
• Package comparison, ASIC comparison, and MEMS die comparison, as well as a MEMS sensing area comparison, are done for each of category.
• Package cross-section, MEMS die cross-section, and ASIC analysis.
• Manufacturing and cost analysis for each of the selected components, and cost comparison.
• An opening and a brief overview are added for EPSON and DENSO inertial sensors.

In the Cost Comparison section, we provide the data for wafer front-end cost distribution by: ASIC and MEMS die cost; packaging cost; final test; and calibration and yield losses cost. These estimations are made based on our cost analysis of the inertial sensors.

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