Technology, Process and Cost Comparison
BCD Technologies Comparison 2026
This comparative report synthesizes the results of detailed physical, technical, supply chain of a selection of 11 BCDs. Moreover, a costing analyses of a more 88 BCDs technologies.
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Analyzed devices:
- Infineon
- Melexis
- X-Fab
- Texas Instruments
- NXP
- GlobalFoundries
- Cirrus
- Apple
- TSMC
- Renesas
- MPS
- GTA Semiconductor
- Novosense
- HHGrace
PHYSICAL ANALYSIS
- Detailed photos in optical and SEM views
- Precise thickness measurements
- Package opening
- LDMOS delayering
- Material identification
Technology
- GlobalFoundries advanced node
- Silicon and SOI substrate
- LOCOS, STI, DTI insulation
- MOSFET with field plate
- BCD technology
- Medium and high voltage IC
Type of Analysis
- SEM View
- TEM View
- Floorplan
- Cross section
- Delayering
- Optical View
- X-ray View
MANUFACTURING PROCESS FLOW
- Recreation of manufacturing process flow
- Step by step process flow
Technical analysis
- Component
- Process
- Wafer
- Material
COST ANALYSIS
- Supply chain evaluation
- Simulation of device cost
Type of Analysis
- Die cost
- Raw wafer cost
- Wafer Front-End cost
Report's Objectives
- In-depth comparative study on 88 BCD technology processes, from the 40 major manufacturers including Infineon, STMicroelectronics, Texas Instruments, TSMC and SMIC.
- Large catalog of BCD structures with technical details on the gate oxide, isolations, metal layers etc.
This report presents an in-depth analysis of the latest innovations in Bipolar-CMOS-DMOS (BCD) devices. It shows the differences between 88 selected devices from Infineon, Melexis, NXP, Texas Intrusments, TSMC, Novosense, GlobalFoundries. The report covers all the major players in the market and their new technologies.
In this 2026 version, you will find:
- More details on the LDMOS transistors, with more measurements.
- Focus on the evolution of the mature technologies
- Three new manufacturers and 2 new foundries: Cirrus, Apple, Novosense and GlobalFoundries, HHGrace.
- 11 new technologies, down to the 40nm lithographic node, and including high voltages.
- An update of the wafer cost calculation for the 77 technologies shown in this report’s 2025 version.
Infineon, Texas Instruments are evolving their technologies and design of their transistors. Some new technologies from Infineon, Melexis, Texas Instruments, Cirrus, Apple, Renesas, NXP, MPS, Novosense, GlobalFoundries, HHGrace has been added. The technologies studied in this report have lithographic technology nodes ranging from 0.5µm to 40nm. The components range from monolithic piloted power transistors to microcontrollers with high-voltage analog inputs and outputs. Four new slides on the evolution of technologies have been added in this report.
For each analyzed device, this report details the manufacturing process and materials used, the component design, and the technical choices. The cost report provides an estimation of the cost structure of the wafers using the various technologies, highlighting the influence of the technological innovations. This report also offers a unique opportunity to understand the technology evolutions and the manufacturing cost of the major BCD manufacturers.
Overview
- Executive Summary
- Product Specification
- Reverse Costing Methodology
- Glossary
Supply Chain
- Supply Chain
- IDM
- Fabless - Foundry
Technologies Evolution
- Transistors
- Isolation
- Metal Layer Process
- Passives
- High Voltage
Foundry Technologies & Cost Analysis
- Infineon - IDM : BCD 0.5µm
- Infienon - IDM : BCD 0.110µm
- Melexis - X-Fab : BCD 0.18µm
- NXP - GlobalFoundries : BCD 40nm
- Texas Instruments - IDM : BCD 0.13µm
- Texas Instruments - IDM : BCD 0.18µm
- Cirrus - GlobalFoundries : 55BCDLite
- Apple - TSMC : BCD 65nm
- Renesas - Renesas : BCD 0.18µm
- MPS - GTA Semiconductor : BCD 0.25µm
- Novosense - HHGrace : BCD 0.18µm
Comparison
- Cost & technology Comparison
Feedback
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About Yole Group
Infineon, STMicroelectronics, Elmos, Bosch, NXP, Littlefuse, Texas Instruments, Analog Devices, Tower Semiconductor, onsemi, Intel, Denso, Renesas, Toyota, Toshiba, Mitsubishi, Rohm, TSMC, DB HiTeK, SMIC, Samsung, Microchip, Reed Semiconductor, Ablic (formerly Seiko), Nisshinbo (Ricoh, NJR), Butterfly Network, Richtek, MPS, SemiMent, GTA Semiconductor, Halo Microelectronics, Xlink, Broadcom, Qorvo, Novosense, HHGrace, GlobalFoundries, Cirrus, Apple and more.