BCD Technology and Cost Comparison 2023

Key Features

• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Cost comparison of 49 technologies

What's new

• Five news companies
• Nine new technologies
• Focus on the latest technology with more advanced technology nodes, up to 65nm.
• Six foundry companies

STMicroelectronics, Infineon Technologies, Elmos semiconductor, Bosch, Melexis, X-Fab, NXP, LittleFuse, Texas Instruments, Analog Devices, Tower Semiconductor, Onsemi, Intel, Denso, Renesas, Toyota, Toshiba, Mitsubishi, Rohm, TSMC, DB HiTeK, SMIC, Samsung, Qualcomm, Maxim, Goodix, HiSilicon, Semtech, Delphi, and more

Overview

• Executive Summary
• Product Specification
• Reverse Costing Methodology
• Glossary

Supply Chain 

• Supply Chain
• IDM
• Fabless – Foundry

Technologies Evolution

• Transistors
  • Summary
  • Gate Oxides
  • LDMOS and VDMOS    
• Isolation 
  • Summary
  • LOCOS and STI 
  • Deep Trench Isolation
  • Substrate SOI
  • Galvanic Isolation
• Metal Layer Process
  • Summary
  • Aluminum and Tungsten Plug
  • Copper Metal Layer
  • Thick Metal Layer
• Passives                                    
  • Summary
  • Capacitor and Resistor in Polysilicon
  • Metal Insulator Metal Capacitor, Inductor, Thin Film Resistor
• Shrink
• High Voltage

Foundry Technologies & Cost Analysis

• Infineon: BCD 90nm
• STMicroelectronics: BCD6s, BCD6s-offline, BCD9
• Melexis-X-Fab: BCD 0.35µm
• NXP: New A-BCD
• Texas Instruments: LBC5 (1200V breakdown voltage)
• Maxim – Tower Semiconductor: BCD 0.35µm
• Semtech - Tower Semiconductor: BCD 0.18µm
• Onsemi: BCD 0.5µm
• Intel: BCD 65nm
• Toshiba: SOI High Voltage
• Mitsubishi: BCD 3µm
• Delphi – TSMC: BCD 0.35µm
• Qualcomm – TSMC: BCD 0.18µm
• Maxim – TSMC: BCD 0.15µm
• Goodix – DB HiTeK: BD180LV
• Hisilicon – SMIC: BCD 0.15µm
• Elmos - Samsung: BCD 0.13µm

Comparison 

• Cost & technology Comparison

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About Yole Group

This report presents an in-depth analysis of the latest innovations in Bipolar-CMOS-DMOS (BCD) devices. It shows the differences between 49 selected devices from Infineon Technologies, STMicroelectronics, Elmos, Bosch, NXP, Littlefuse, Texas Instruments, Analog Devices, Tower Semiconductor, onsemi, Intel, Denso, Renesas, Toyota, Toshiba, Mitsubishi, Rohm, TSMC, DB HiTeK, SMIC and Samsung. The report covers all the major players in the market and their new technologies.

In this 2023 version, you will find:

• More details on the LDMOS transistors, with more measurements.
• Five new manufacturers: onsemi, Intel, SMIC, Samsung and DB HiTeK.
• Nine new technologies, down to the 65nm lithographic node, and including high voltages.
• An update of the wafer cost calculation for the 40 technologies shown in this report’s 2021 version. Several effects of COVID and semiconductor shortages on manufacturing cost have been simulated for this update.
• A focus on foundry technologies with six companies: X-Fab, Tower Semiconductor, TSMC, SMIC, Samsung and DB HiTeK

BCD has been developed to simplify the control of power devices by proposing a monolithic Integrated Circuit (IC) solution to integrate the gate driving circuit and current/temperature measurements to protect the power component in the same silicon IC.

The 2023 report adds four new technologies from three manufacturers already present in the 2021 version. The five new manufacturers, onsemi, Intel, SMIC, DB HiTeK and Samsung, have adopted very different solutions analyzed in this report. The technologies studied in this report have lithographic technology nodes ranging from 3µm to 65nm. The components range from monolithic piloted power transistors to microcontrollers with high-voltage analog inputs and outputs.

For each analyzed device, this report details the manufacturing process and materials used, the component design, and the technical choices. The cost report provides an estimation of the cost structure of the wafers using the various technologies, highlighting the influence of the technological innovations.

This report also offers a unique opportunity to understand the technology evolutions and the manufacturing cost of the major BCD manufacturers. It furnishes the basics for an optimal choice of components during design and integration.

In this report, Yole SystemPlus analyzes and compares products from the 24 main manufacturers, with a focus on technology evolution and a description of the cost impact of these innovations. Technical and cost comparisons of the main parameters, transistors, metal layers, isolation, and passives are all performed.