Technology, Process and Cost

Bosch - CSL 1200V SiC Power Module

Mar 2026

Deep-dive analysis of the Bosch CSL 1200V SiC power module with proprietary Gen2 SiC dies.

SPR26040

ANALYZED DEVICES

Bosch CSL 1200V SiC Power Module (direct-cooled pin-fin baseplate)
Bosch Gen2 SiC dies

PHYSICAL ANALYSIS

Detailed photos in optical and SEM views
Precise thickness measurements
Package opening and cross-section
Die delayering and cross-section
Material identification, EDX Analysis

REPORT’S OBJECTIVES

Provide a reverse costing study of the Bosch 1200V SiC power module
Deliver physical and technology analysis down to MOSFET design level (optical, SEM, EDX)
Analyze Bosch CSL packaging innovations and die interconnection on ceramic substrate
Detail the design of Bosch Gen2 SiC MOSFET chips
Reconstruct the full manufacturing process (front-end to back-end)
Provide full cost breakdown: epi-wafer, FE wafer, die, packaging, module on cooler, with yield modeling and price estimation

Tightening environmental regulations aimed at reducing average CO₂ emissions are accelerating the global shift toward vehicle electrification. This regulatory pressure is driving increased adoption of electric and hybrid electric vehicles (xEVs). In response to these trends, Yole Group forecasts that the xEV market will reach 64.3 million vehicles by 2030, with battery electric vehicles (BEVs) accounting for 27.9 million.

In this evolving landscape, Bosch has introduced its CSL (Compact Silicon Carbide Line) power module family for traction inverters. The CSL family is scalable for power ratings from 75 kW to 250 kW. In this report, Yole Group analyzes the CSL SiC power module, featuring Gen2 1200V SiC MOSFETs from Bosch. This leading-edge power module exemplifies the industry's move toward compact and high-performance solutions while leveraging the advantages of trench silicon carbide technology. It features double-sided sintering technology of the SiC dies with optimized interconnect technology.

Yole Group delivers a comprehensive reverse costing study of the Bosch CSL 1200V SiC power module, detailing its internal architecture and packaging innovations. Supported by a complete analysis of the design of the Bosch 1200V Gen2 SiC MOSFET dies as well as the full teardown of the module packaging (opening/deprocessing and cross-section, optical and SEM images with EDX analyses for package and SiC MOSFET dies), the Yole report reveals Bosch’s innovative technology choices for assembling its SiC dies and module.

This report includes insights into the module's technology and simulated manufacturing cost of the module, as well as an estimated selling price of the final power module.

Included is a full teardown of the CSL module, highlighting Bosch’s design and material choices and detailed manufacturing process steps with cost breakdown of all module parts.

This report provides valuable intelligence for stakeholders across the EV supply chain, from OEMs and Tier-1 suppliers to packaging solution providers and power module manufacturers, as they navigate the evolving market and technological landscape.

Additionally, this Bosch CSL module will be featured in the upcoming “Automotive Power Module Packaging Comparison 2026”, where it will be benchmarked against competing solutions from other leading manufacturers.