Technology, Process and Cost
Bosch Mid Range Radar (MRR) Sensor
By Yole SystemPlus —
A compact, cost-effective and high-performance driving assistance system
Overview/Introduction
- Executive Summary
- Company Profile & Main Features
- Reverse Costing Methodology
Physical Analysis
- Global View of the Radar
- Views and Dimensions of the Radar
- Radar Teardown
- Electronic Boards
- Power Management Board
- Global View
- High Definition Photo
- Components Markings
- Components Identification
- RF Board
- Global View
- High Definition Photo
- Components Markings
- Components Identification
- RRN7745P Package
- RRN7745P Die
- RTN7735P Package
- RTN7745P Die
Cost Analysis
- Estimation of the cost of the PCBs
- Estimation of the Cost of the Freescale SC667226MMMA
- Estimation of the Cost of the STMicroelectronics A267BB
- Estimation of the Cost of the Bosch 510BC
- BOM Cost – Power Management Board
- BOM Cost – RF Board
- BOM Cost – Housing
- Material Cost Breakdown
- Accessing the Added Value (AV) cost
- Power Management Board Manufacturing Flow
- RF Board Manufacturing Flow
- Details of the Housing Assembly & Functional Test Costs
- Added Value Cost Breakdown
- Manufacturing Cost Breakdown
Estimated Price Analysis
- Estimation of the Manufacturing Price
The Mid Range Radar Sensor, with its three Transmitter and four Receiver channels, operates in the 76-77 GHz frequency band that is standard for automotive radar applications. The front version works with an aperture angle of up to +/- 45 degrees and can detect objects up to 160 meters away. With a compact design (using fan-out RF components from Infineon), the system is easy to integrate into a vehicle’s body.
The system integrates two electronic boards including Bosch, Freescale and STMicroelectronics circuits. The RF board is manufactured with an asymmetric structure using Hybrid PTFE/FR4 substrate and is equipped with planar antennas.
Infineon 77GHZ SiGe Monolithic Microwave Integrated Circuits (MMIC) are used as High-Freqency transmitter and receiver.. The two RF dies are packaged is the last version of the eWLB, the Fan-Out Wafer level Package developed and manufactured by Infineon
Based on a complete teardown analysis of the Bosch MRR Sensor, the report provides the bill-of-material (BOM) and the manufacturing cost of the Radar Sensor.
A complete physical analysis and manufacturing cost estimation of the Infineon MMICs is available in a separate report.
ANALYSIS PERFORMED WITH OUR COSTING TOOLS SYSCost+
Defining the cost of an electronic system requires an estimation of all component costs, including PCB, housing and connectors, and a simulation of the cost of the assembly and test process at the board and system level.
The costing modules included in SYScost+ answer all these requirements and help costing engineers get accurate calculations.
SYScost+ is flexible in order to be used in multiple applica-tions.
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Material Analysis
- Bill of Material
- Manufacturing Process Flow
- Manufacturing Cost Analysis
- Manufacturing Price Estimation