Technology, Process and Cost
Bosch SiC Module - PM6 on cooler with SiC Gen2 die
An in-depth analysis of Bosch’s innovative PM6 module on cooler, featuring 2nd Gen SiC dies and advanced assembly design
SPR25945Key Features
- Physical Analysis of the module packaging in detail (opening, optical and SEM cross-section, material EDX analysis)
- Physical Analysis of the Bosch Gen2 SiC Trench MOSFET (delayering, optical and SEM cross-section, material EDX analysis)
- Detailed manufacturing process step-by-step (from die Front-End wafer up to the module Back-End packaging)
Cost analysis: Epi-wafer and FE wafer cost breakdown, Die cost breakdown, Packaging cost breakdown, module on cooler cost breakdown, and price estimation
Report’s objectives
- Provide a comprehensive reverse costing study of the leading-edge PM6 module platform from Bosch.
- Provide exhaustive physical and technology analysis (Optical and scanning electron microscope (SEM) images with EDX material analysis) from the module’s opened package, down to the microscopic level of MOSFET design.
- Analyze Bosch packaging innovations for its PM6 platform. This includes Bosch’s innovative technology choices for assembling its SiC dies as well as the assembly of each of the power module cards to get the final module-on-cooler.
- Provide for the first time a detailed analysis of the design of the 2nd generation of Bosch SiC trench MOSFET
- Provide detailed manufacturing process step-by-step (from die Front-End wafer up to the module Back-End packaging)
- Provide an exhaustive cost analysis: Epi-wafer and FE wafer cost breakdown, Die cost breakdown, Packaging cost breakdown, module on cooler cost breakdown, and price estimation with a detailed Yield model for each process cost sequence (Wafer, die, packaging)
Tightening environmental regulations aimed at reducing average CO₂ emissions are accelerating the global shift toward vehicle electrification. This regulatory pressure is driving increased adoption of Electric and Hybrid Electric Vehicles (xEVs). In response to these trends, Yole Group forecasts that the xEV market will reach 64.3 millions vehicles by 2030, with Battery Electric Vehicles (BEVs) accounting for 27.9 million.
In this evolving landscape, Bosch has introduced its Power Module Family 6 (PM6), engineered for high power density and designed with a flexible cooler architecture. This new generation of modules reflects the industry's push toward compact, thermally efficient, and high-performance solutions. In this report, Yole Group analyzes the a PM6 SiC Power Module on Cooler, featuring Gen2 750V SiC MOSFETs from Bosch. This leading-edge power module exemplifies the industry's move toward compact, thermally optimized, and high-performance solutions while leveraging the advantages of trench silicon carbide technology. It shows a low Rdson of 2 mOhm (25°C, VGS= 18V, 420A). The PM6 platform is scalable by chip configuration (from 4 to 12 chips per half-bridge leg) and by cooler type enabling a large output current range within one mechanical package outline. The sandwich architecture of the PM6 platform employs an innovative design approach to achieve an efficient current distribution. Each single half-bridge power card of the analyzed module-on-cooler, is compatible with standard gate drivers thanks to it common-gate topology.
Yole Group delivers a comprehensive reverse costing study of the Bosch 750V Gen2 SiC Power Module PM6, detailing its internal architecture and packaging innovations. Supported by a complete analysis of the design of the Bosch Gen2 SiC MOSFETs dies as well as the full teardown of the module packaging (Opening/deprocessing and cross-section, optical and SEM images with EDX analyses for package and SiC MOSFET dies), Yole report reveals Bosch’s innovative technology choices for assembling its SiC dies as well as the assembly of each of the power module cards to get the final module-on-cooler. This report includes insights into the module's technology, and simulated manufacturing cost of all the module’s as well as an estimated selling price of the final power module.
Included is a full teardown of the PM6 module, highlighting Bosch’s design and material choices and a detailed manufacturing process steps with cost breakdown of all module’s parts.
This report provides valuable intelligence for stakeholders across the EV supply chain, from OEMs to Tier 1 suppliers and semiconductor manufacturers, as they navigate the evolving market and technological landscape.
Additionally, this Bosch PM6 module will be featured in the upcoming “Automotive Power Module Packaging Comparison 2025”, where it will be benchmarked against competing solutions from other leading manufacturers.
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
- Glossary
Company Profile
Physical Analysis
- Summary
- Package Analysis
- Package View & Opening
- Package Cross-Section
- SiC MOSFET Die Analysis
- Die Views & Dimensions, Die Delayering
- Die Cross Section
Manufacturing Process Flow
- Wafer Fab Unit
- SiC Wafer Process Flow Sketches
- Assembly Unit
- Assembly Process Flow
Cost Analysis
- Main Steps of the Economic Analysis
- Yields Explanation and Hypotheses
- SiC Wafer & Die Costs
- Substrate Assembly Cost
- Packaging Cost
- Module Cost
Selling Price
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