Technology, Process and Cost

Bosch SiC Module - PM6 on cooler with SiC Gen2 die

An in-depth analysis of Bosch’s innovative PM6 module on cooler, featuring 2nd Gen SiC dies and advanced assembly design

SPR25945

Key Features

  • Physical Analysis of the module packaging in detail (opening, optical and SEM cross-section, material EDX analysis)
  • Physical Analysis of the Bosch Gen2 SiC Trench MOSFET (delayering, optical and SEM cross-section, material EDX analysis)
  • Detailed manufacturing process step-by-step (from die Front-End wafer up to the module Back-End packaging)
    Cost analysis: Epi-wafer and FE wafer cost breakdown, Die cost breakdown, Packaging cost breakdown, module on cooler cost breakdown, and price estimation


Report’s objectives

  • Provide a comprehensive reverse costing study of the leading-edge PM6 module platform from Bosch.
  • Provide exhaustive physical and technology analysis (Optical and scanning electron microscope (SEM) images with EDX material analysis) from the module’s opened package, down to the microscopic level of MOSFET design.
  • Analyze Bosch packaging innovations for its PM6 platform. This includes Bosch’s innovative technology choices for assembling its SiC dies as well as the assembly of each of the power module cards to get the final module-on-cooler.
  • Provide for the first time a detailed analysis of the design of the 2nd generation of Bosch SiC trench MOSFET
  • Provide detailed manufacturing process step-by-step (from die Front-End wafer up to the module Back-End packaging)
  • Provide an exhaustive cost analysis: Epi-wafer and FE wafer cost breakdown, Die cost breakdown, Packaging cost breakdown, module on cooler cost breakdown, and price estimation with a detailed Yield model for each process cost sequence (Wafer, die, packaging)

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