Broadcom PMIC 59367 from iPhone 16 Wireless Charging

Key Features

• Detailed photos
• Precise measurements
• Packaging structural analysis with X-ray & optical analysis
• Front-end structural analysis with scanning electron microscopy
• Manufacturing process flow
• Insights into the global view of manufacturing
• Specific steps including wafer fabrication, back-end operations, and final assembly/testing
• Manufacturing and supply chain cost analysis
• Costs detailed for:
  • Front-end wafer production
  • Back-end wafer and IC die manufacturing
  • Packaging and component costs

Broadcom PMIC 59367: Advanced Power Management from Iphone 16

This full reverse-costing study has been conducted to provide insights into the technology data, manufacturing cost, and selling price of the Broadcom PMIC 59367.

The BCM59367 manages power conversion from wireless charging systems, ensuring that the received power is converted to a lower, stable voltage to efficiently power the device’s processor and peripherals. Built using TSMC’s cutting-edge 40 nm BCD technology, it offers a highly compact, high-performance solution that integrates both power regulation and control functionality. This PMIC is notable for its ability to handle high-voltage power management alongside low-voltage logic, all within a single integrated circuit, representing a significant advancement in power management solutions.

Overview/Introduction 

• Executive Summary
• Product Specification
• Reverse Costing Methodology
• Glossary

Physical Analysis

• Summary
• Packaging Assembly
• IC Die

Manufacturing Process

• Global View
• Wafer Fabrication Unit
• Back-End 0
• Assembly & Final Test
• Summary

Cost Analysis

• Summary
• Yields Explanation & Hypotheses
• Front-End Wafer Cost
• Wafer Back-end 0 Cost
• IC Die Cost
• Packaging Cost
• Component Cost

Selling Price

• Definitions of Price
• Manufacturer Financials
• Estimated Selling Price

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About Yole Group

Apple, Broadcom, TSMC