BYD SiC Power Module in Han L Rear Inverter

Key Features

• Physical Analysis of the module packaging in detail (opening, optical and SEM cross-section, material EDX analysis)
• Physical Analysis of the BYD SiC MOSFET (delayering, optical and SEM cross-section, material EDX analysis)
• Detailed manufacturing process step-by-step (from die Front-End wafer up to the module Back-End packaging)
• Cost analysis: Epi-wafer and FE wafer cost breakdown, Die cost breakdown, Packaging cost breakdown, module cost breakdown, and price estimation

What's new

• BYD SiC MOSFET chip
• Die attach and interconnection technology
  

Tightening environmental regulations aimed at reducing average CO₂ emissions are accelerating the global shift toward vehicle electrification. This regulatory pressure is driving increased adoption of Electric and Hybrid Electric Vehicles (xEVs). In response to these trends, Yole Group forecasts that the xEV market will reach 64.3 millions vehicles by 2030, with Battery Electric Vehicles (BEVs) accounting for 27.9 million.
In this evolving landscape, BYD has launched in April 2025 the Han L sedan, introducing ultra-fast charging technology.

For the first time in the industry, Yole Group analyzes the BYD’s SiC power module, integrated into the rear inverter of one of the first mass-produced Han L vehicles on the road.
The power module features proprietary SiC MOSFET chips from BYD with innovative interconnect and die assembly technology for module packaging.

Yole Group delivers a comprehensive reverse costing study of the BYD’s direct cooled SiC Module in Han L Rear Inverter, detailing its internal architecture and packaging innovations.
Supported by a complete analysis of the design of the BYD’s SiC MOSFET dies as well as the full teardown of the module packaging (Opening/deprocessing and cross-section, optical and SEM images with EDX analyses for package and SiC MOSFET dies)​, Yole report reveals BYD’s innovative technology choices for assembling its SiC dies.

This report includes insights into the module's technology, and simulated manufacturing cost of all the module’s parts as well as an estimated selling price of the final power module.​
Included is a full teardown of the BYD module, highlighting BYD’s design and material choices and a detailed manufacturing process steps with cost breakdown of all module’s parts.
This report provides valuable intelligence for stakeholders across the EV supply chain, from OEMs to Tier 1 suppliers, material suppliers, and semiconductor manufacturers, as they navigate the evolving market and technological landscape.

Overview / Introduction

• Executive Summary
• Reverse Costing Methodology
• Glossary

Company Profile 

Physical Analysis 

• Summary
• Package Analysis
• Package View & Opening
• Package Cross-Section
• SiC MOSFET Die Analysis
• Die Views & Dimensions, Die Delayering
• Die Cross Section

Manufacturing Process Flow 

• Wafer Fab Unit
• SiC Wafer Process Flow Sketches
• Assembly Unit
• Assembly Process Flow

Cost Analysis 

• Main Steps of the Economic Analysis
• Yields Explanation and Hypotheses
• SiC Wafer & Die Costs
• Substrate Assembly Cost
• Packaging Cost
• Module Cost

Selling Price 
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