CISCO - QDD-400G ZR-S Optical Transceiver Die Analysis

Report objectives

 

This report examines the key components of the CISCO QDD-400G ZR-S optical transceiver, a 400G module designed for metro access networks with transmission distances up to 120 km.

It highlights the silicon photonic die, the core of the system, which integrates 16QAM modulation functions and a coherent receiver.

It also presents the tunable laser implemented in a nano-ITLA module with an external cavity design.
The report further details the main integrated circuits that drive the optical transceiver, including the DSP, TIA, MZM modulator driver, and laser driver.

 

 

 

Key features

• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated Selling Price
• Silicon photonic die for coherent optical fiber communications

 

 

This reverse costing study has been conducted to provide insight on the technology data, manufacturing cost, and selling price of the main components found in the CISCO QDD 400G ZR-S Optical Transceiver, with a focus on the silicon photonic die and the external cavity tunable CW laser.

You can find the mechanical and electronic assembly analysis and costing in our Teardown Track:

CISCO QDD-400G-ZR-S Optical Transceiver Module

The optical transceiver operates over a single fiber and supports 16-quadrature amplitude modulation (16QAM). The nano-ITLA module provides the optical carrier to the silicon photonic die, which is responsible for both generating the transmitter signal and performing coherent detection of the received signal. The silicon photonic die modulates the signal, multiplexes the transmission, demultiplexes the reception, and detects the incoming optical data.

• CISCO’s QDD 400G ZR-S allows communication up to 120 km in DP-16QAM. The CISCO solution is based on a coherent measure with an external cavity tunable continuous wave laser.
• CISCO DSP for processing input and output data.
• The TIA die and the laser driver are from CISCO / Acacia. The TIA dies are based on a SiGe BiCMOS technology.
• The light is generated by one EEL gain chip laser die. The laser module has been developed by Lumentum / NeoPhotonics. It is a nano-ITLA module.
• All the other optical functions are performed by the silicon photonic BANFF die from CISCO.

This report delivers a comprehensive analysis of the CISCO QDD-400G-ZR-S optical transceiver. It includes an in-depth investigation of key internal components, such as the laser die, silicon photonic die, transimpedance amplifier (TIA) circuit, modulator driver circuit, and the 400G digital signal processor (DSP). The study also includes a detailed cost breakdown and pricing estimation.

A complete physical teardown was performed, incorporating scanning electron microscopy (SEM), cross-sectional imaging, and energy-dispersive X-ray spectroscopy (EDX) to identify materials and unveil the technical specifications of the transceiver’s critical elements. The report provides valuable insights into Cisco’s design and technology choices for this optical transceiver. Additional subsystems—including electronic, optical, and mechanical housing components—are also analyzed in the SPTT25001 report. The study further details the optical interface and assembly workflows. Finally, a comprehensive cost estimation for the assembly of both optical and electronic modules is presented.

• Overview / Introduction
  • Executive Summary
  • Reverse Costing Methodology
  • Optical Transceiver Applications
  • Glossary
• Company Profile
• Physical Analysis
  • Summary
  • Module & Optics
    • Teardown
    • Fiber Optics
    • Main Board
    • Laser Board
    • Photonic Board
  • CISCO DSP
    • Overview
    • Cross Section
    • Process
  • CISCO Silicon Photonic Die
    • Overview
    • Transmitter
    • Receiver
    • Tests
    • Cross Section
    • Process Summary
  • CISCO MZM Driver Die
  • CISCO TIA Die
  • Lumentum nano-ITLA Laser Module
  • Lumentum InP CW Gain Chip
  • NTT NLM0123BPB laser driver
• Manufacturing Process Flow
  • Overview
  • CISCO DSP
  • ACACIA Driver Flow & Unit
  • ACACIA TIA Flow & Unit
  • ACACIA SiPh Flow & Unit
  • InP CW Laser Flow & Unit
  • Laser Module Flow & Unit
  • Transceiver Assembly Unit

• Cost Analysis
  • Main Steps of Analysis
  • Yields Explanation & Hypotheses
  • CISCO DSP Cost
  • CISCO MZM Driver Cost
  • CISCO TIA Cost
  • CISCO SiPh Cost
  • LUMENTUM EEL Cost
  • Laser Module Cost
• Feedback
• Related Products
• About Yole Group

Acacia , Analog Devices, Cisco, GlobalFoundries, Lumentum, NeoPhotonics, NTT Innovative Devices, TSMC