Technology, Process and Cost
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems
By Yole SystemPlus —
Continental consolidates its successful role in ADAS-related equipment with this cost-effective solution for emergency brake assist
Light detection and ranging (LiDAR) sensing has a wide spectrum of applications, one of which is in autonomous or “self-driving” cars. LiDAR is therefore attracting attention from the automotive industry, as well as other fields. However, until now, systems haven’t matched challenging automotive specifications for reliability, compact-ness, and cost-efficiency.
Based on rugged design and components, the SRL-1 from Continental provides a reliable and efficient solid-state LiDAR for frontal impact detection without any mechanical movement. Detecting collisions in an urban environment at speeds up to 50km/h, including an emergency braking assist (EBA) function, makes this product a great asset for today’s autonomous and assisted driving needs.
A mature but efficient strained InAlGaAs/GaAs quantum well-structure laser photodiode from OSRAM is the SRL-1’s light emitter. This choice reduces costs and enables measurement of the distance to objects without a reflector. The SRL-1 uses the time-of-flight technique with a very high repetition rate thanks to a Freescale processing chipset and application specific integrated circuit (ASIC).
The integration and design of the system provide a light and compact system. It can therefore be used in several types of personal or industrial vehicle without being too invasive. That design also keeps its price low relative to competing products. This report details the full Continental SRL1 system’s manufacturing and packaging processes, as well as an estimation of the manufacturing cost and selling price.
REVERSE COSTING WITH
- Detailed photos
- Precise measurements
- Material analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Selling price estimation
Overview / Introduction
Company Profile
System Physical Analysis
Views and Dimensions
- System Opening and Overview
- Mother Board- Top side – overview
– Top side – high definition photo
– Top side – PCB markings
– Top side – main component markings
– Top side – main component identification
– Top side – other component markings
– Top side – other component identification
– Bottom side – high definition photo
– Bottom side – component identification- Daughter Board
Cost Analysis
- Accessing the BOM
- PCB Cost
- ASIC Estimation Cost
- BOM Cost – Electronic Boards
- BOM Cost – Housing
- Material Cost Breakdown
- Accessing the Added Value (AV) Cost
- Electronic Boards Manufacturing Flow
- Details of the Housing Assembly and Functional Test Costs
- Added Value Cost Breakdown
- Manufacturing Cost Breakdown
Selling Price
- Estimation of the Manufacturing Price
- Estimation of the Selling Price