Technology, Process and Cost
CXMT G4 DDR5 DRAM
Nationally supported and strategically positioned, CXMT leads DDR5 DRAM innovation and drives China’s memory industry forward
SPR25940Key features
- Detailed photos
- Precise measurements
- Die analysis
- Package analysis
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Physical Comparisons
- Technical Comparisons
- Cost Comparisons
- New generation of CXMT’s DRAM. Advanced technology node.
- Most performing DDR5 in China
Product's objectives
This Technology & Cost report analyzes CXMT’s DDR5 DRAM, found in a Kingbank DIMM, to assess whether the company can emerge as a serious competitor to current DDR5 market leaders.
- Exploring the technology behind the CXMT's G4 DDR5 DRAM in China
- Insight into the DRAM technology used by leading players
- A comprehensive study of the physical structure and detailed process flow of the array part.
- A detailed perspective on the DDR5 architecture, clearly highlighting the area allocation for storing data (array) and the periphery logic (CMOS area)
In 2024, global memory revenue hit $170B (+78% YoY), driven by a strong DRAM market rebound. DRAM alone reached $97B (+87%), boosted by higher prices and shipments, with an average selling price rising 61% to $0.38/Gb. Changxin Memory Technologies (CXMT) disrupted the market by offering competitively priced DDR3 and DDR4 products, pushing major players to accelerate DDR5 and HBM adoption. CXMT launched DDR5 production late 2024 and is now emerging as a key DRAM player, leveraging 16 nm technology and a 55 nm CMOS logic node for higher density and efficiency. CXMT's DDR5 is emerging as the most advanced and highest-performing DDR5 in China. While focusing on yield stabilization and capacity ramp-up over short-term profits, CXMT faces challenges from local competitors and policy shifts. A detailed reverse engineering study highlights CXMT’s technological edge and competitive manufacturing costs, underscoring its rising position in the global DRAM industry.
Overview
- Executive Summary
- Product Specifications
- Reverse Costing Methodology
- Glossary
Company Profile
- CXMT
- Location
- DDR5 DRAM
Market Analysis
- Revenue
- Market Share
Physical Analysis
- Summary
- Module Disassembly
- Memory Package Analysis (overview, X-Ray Images, cross section, opening)
- Memory Die Analysis (overview, cross section, opening, delayering, process)
Manufacturing Process Flow
- Global Overview
- DRAM Front-End Process
- DRAM Front-End Wafer Fabrication Unit
- DRAM Manufacturing Process
- Assembly and Final Test
Cost Analysis
- Cost Summary
- Yields Explanation & Hypotheses
- DRAM Die Front-End Wafer Cost
- DRAM Die Cost
- Packaging Cost
- Component Cost
Selling Price
- Definitions of Price
- Estimated Selling Price
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