Technology, Process and Cost
DENSO SiC Power Module in the Toyota Mirai II
By Yole SystemPlus —
Discover the technology, design, and cost analysis of DENSO’s SiC module, the first to be used in fuel cell electric vehicles.
The new environmental regulations to reduce average CO2 emissions, along with automotive trends, play in favor of greater vehicle electrification and faster deployment of electric vehicles/hybrid electric vehicles (EV/HEVs). Yole Développement expects the EV/HEV market to reach 41 million vehicles by 2026 according to the Power Electronics for E-Mobility 2021 report.
Numerous carmakers continue qualifying SiC devices in main inverters, OBC, and DC/DC converters for their next-generation models. Toyota is one of the pioneers in integrating SiC dies in their vehicles and, now it is the first car maker using a SiC MOSFETs in fuel cell electric vehicle (FCEV). In fact, the Toyota Mirai II integrates a SiC based power module in the boost converter.
In this context, System Plus Consulting provides a full reverse costing study of the DENSO SiC Power Module in the Toyota Mirai II.
Supported by a full teardown of the module, this report reveals DENSO’s technology choices in its SiC MOSFET, as well as the design of the module’s packaging and diode chip. The module is assembled with the standard molding technology of Denso and uses spacer for better thermal dissipation. The two dies are assembled with clips and wire bonding.
Detailed optical and SEM images with precise measurements show the structure of the transistor and the diode. Then a complete analysis of the supply chain is performed, and the dies process flow is described step-by-step.
This report provides insights into technology data, manufacturing cost, and selling price of the module. Also furnished is an estimated manufacturing cost of all the module’s components, as well as a selling price analysis.
Company Profile
- DENSO Company Profile
- SiC Technology
- Toyota Mirai II FCEV
Physical Analysis
- Synthesis of the Physical Analysis
- Package Analysis
- Package Opening
- Package Cross-Section
- SiC MOSFET Die
- SiC MOSFET Die View & Dimensions
- SiC MOSFET Die Process
- SiC MOSFET Die Cross-Section
- Diode Die
- Diode Die View & Dimensions
- Diode Die Process
- Diode Die Cross-Section
Manufacturing Process
- SiC MOSFET Fab Unit and Process Flow
- Diode Fab Unit and Process Flow
- Packaging Fab Unit
- Packaging Process Flow
Cost Analysis
- Synthesis of the Cost Analysis
- Yields Explanation & Hypotheses
- SiC MOSFET
- SiC MOSFET Front-End Cost
- SiC MOSFET Wafer Cost per Process Step
- SiC MOSFET Die Probe Test & Dicing
- SiC MOSFET Die Cost
- Diode
- Diode Front-End Cost
- Diode Wafer Cost per Process Step
- Diode Die Probe Test & Dicing
- Diode Die Cost
- Source & Drain Plates Cost
- BOM Cost & Assembly Cost
- Module Cost
- Packaging BOM & Assembly Cost
- Module Final Cost
Selling Price Analysis
Estimation of Selling Price
Complete teardown with:
- Detailed optical and SEM photos
- Precise measurements
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
