Glass Materials for Advanced Packaging 2025

Key Features

• Revenues Forecast of GCS, Glass interposers, Glass carriers and also Wafer/Panel Shipments.
  
• GCS, GI, TGV Process flows.
  
• Market trends per applications.
  
• 2025 updated detailed supply chain.
  
• Emerging business models
  
• Disruptions of glass applications
  
• Preconditions for take off
  
• Glass composition and parameters for different applications and more

Report objectives

This report is a newly released study dedicated to glass materials in Advanced Packaging.
It focuses on the following key chapters:

• Glass Core Substrates
• Glass Interposer
• Glass Carrier
• Through Glass Via (TGV)
• Emerging Technologies

For each advanced packaging platform, the report provides an overview of the following:

• Market trends and drivers: key applications and our industry roadmap forecasts
• Forecasts: production volume, panel production volume, and revenue projections
• Technology roadmap: current technologies and their descriptions
• Supply chain: key players, adoption status, and supply chain structure
• In addition, the report includes a dedicated overview of the Chinese ecosystem.
  

Glass For Advanced Packaging Market – Dual-Engine Growth in Datacenter, RF, and Optics.
Glass is becoming a platform purchase across end-markets, led by data centers and telecom. In data centers, it guarantees the two critical packaging vectors: chiplet fabrics and optical I/O. Low-CTE, deep-UV glass carriers standardize hybrid-bond preparation and thin-wafer backside at 300 mm, panel carriers matter as switch/accelerator bodies outgrow wafer-stepper fields. The GCS substrate has the potential to reach $ 460M by 2030 with an optimistic scenario of adoption starting the 2027-2028 horizon while Glass interposer is set to reach more than $ 400M beyond 2030 with a conservative adoption scenario and the stabilizing glass application in carrier represents a market of $ 500M.

From Carrier to Platform – The Global Supply Chain for Glass Carriers, Cores, and Interposers
Glass in advanced packaging is now a platform business, not a parts business. For glass carriers, the revenue pool has shifted from plate price to $ per pass, reuse cycles, laser/UV debond throughput, yield, and edge-damage avoidance determine economics. That opens near-term wins for suppliers offering CTE-graded families, for bundle owners that sell carrier + adhesive/LTHC + debonding as a single qualified stack, and for regional reclaim providers with optical QA, firms with deep glass know-how (e.g., Plan Optik’s model of high-flatness, controlled-transmission carriers with engineered edges sold in bundles) are best positioned. Glass core substrates monetize display-line panel capacity by adding TGV + fine RDL + build-up, the winners sit at the interfaces:high-yield TGV drill/etch with void-free Cu fill, panel lithography with adaptive overlay, 2/2 µm L/S, and panel handling that holds warpage. Substrate houses and OSATs that partner with display-glass makers convert area throughput into a cost edge for large packages.

Beyond Silicon – How Glass Enables Next-Gen Packaging at Scale
Glass has shifted from a simple carrier to a full materials platform for advanced packaging, answering the megatrends of chiplets, panelization, vertical integration, and hybrid bonding while tightening mechanical, thermal, and cleanliness budgets. As carriers (wafer and panel), transparent, low-CTE glass enables through-carrier alignment and laser/UV debond with minimal stress, boosting yield for sub-50 µm wafers, backside flows, and reconstituted panels with multi-use economics. As a glass core substrate, it replaces organic cores to support panel-scale manufacturing: TGVs deliver dense vertical power/signal, SAP RDL pushes beyond 2/2 µm, flat base, warpage drops via CTE tuning, and transparency readies the package for co-packaged optics, the thermal tradeoff is addressed with copper planes, stitching vias, BSPDN, and dual-side cooling. As a glass interposer, it wins in two modes: passive, where very large 2.5D AI/HPC and switch builds achieve wiring density and bump counts at cost/area silicon struggles to match, and active, where in-substrate SIW/filters/antennas and metalized-trench or laser-written waveguides collapse RF chains and bring optical I/O to the edge with low loss.

3DGS, 4jet, Absolics, Access, ACE Pillar, Achiles, AGC, Ajinomoto, AKMMV, AMD, AMEC, AP Systems, Applied Materials, ASMPT, Atometrics, Avaco, AWS, BOE, BRET, C Sun, C\&G Tech, CGP materials, CHD TECH, Chemtronics, CKPlas, Coherent, Contrel, Corning, DMS, DNP, DR laser, E\&R, Favite, FICT, FNS Tech, GH laser, Gigaphoton, GP Group, Han’s laser, HB technology, HBL, HCVAC, Hengli, Hi Semico, Hiwin, Huaray, IBDTEC, ibiden, IMHH, Intel, JNTC, JoongWoo, Julong, Junsung, KCC, Keyence, Koto, KSDW, Lam research, LG Innotek, Lincotec, LPKF, Manz, Megmeet, Meta, Micro technology, Microsoft, Mirle, Mitsui Chemicals, MKS Atotech, NEG, Nichiwa kogyo, NSC, NSG, Nvidia, Okuno, Onto Innovation, Opton, Philoptics, Pie, PlanOptik, Qorvo, RENA, Resonac, Samsung, Samsung Display, Samsung electro-mechanics, Sceitnech, Schmid, Schott, SEA, Sevenstar, Shinko, Sholaser, Shyaweo, Sindin, SKC, SKY semiconductor, Skytech, Soulbrain, Sunrise, Taesung, Taotao, Tecnisco, TECSUN, TKK, Toray, TRUMPF, TZTEK, Unimicron, Ushio, Uyemura, Vega Technology, Via Mech, WG Tech, Woowon Technology, ycchem, YES, Yinrui, YMT, and more